Principal Engineer Platform Management

This role is responsible for defining and driving the package platform roadmap and strategy to achieve business KPIs like time-to-market, quality, benchmark cost, and innovation. Key responsibilities include managing the package platform's technical capability and portfolio, optimizing package cost, releasing platform strategy, defining capability for in-house and subcon production, and initiating technology development projects. The role also involves supporting package concept engineers in new product design-in to align with platform capabilities.

Must Have

• Masters/Bachelor’s Degree in Engineering (Electrical / Electronics / Microelectronics / Mechanical / Materials)
• 6-8 years of experience in semiconductor industry
• Experience in road-mapping and strategy definition
• Knowledge in semiconductor package engineering
• Business risk and impact analysis
• Capability in anticipating and resolving issues quickly

Perks & Benefits

• Career development & learning
• Time & flexibility
• Health & wellbeing
• Your working environment
• Rewards & benefits

Job description

Your Role

Key responsibilities in your new role

• Responsible for package platform roadmap and to manage package platform current and future technical capability, portfolio and to optimize package cost position.
• Manage platform portfolio during whole life cycle ,identifies platform capability and its extensions, supports definition of new products in platform, product changes, transfer and ramp-down.
• Release platform strategy aligned to segment management as owner. Defines capability (package portfolio, BoM, reliability, production line location) of platform inhouse and subcon production.
• Owner of platform design rules (BDR) (release, maintain and update) and as owner of standard package catalogue.
• Initiate and monitors technology development projects on platform to improve cost position, package reliability and technical capability (inhouse and subcon).
• Supports package concept engineers in product lines and backend segments on new product design in to match with current and future platform capability .

Your Profile

Qualifications and skills to help you succeed

• Masters/Bachelor’s Degree in Engineering (Electrical / Electronics / Microelectronics / Mechanical / Materials ).
• 6-8 years of experience in semiconductor related industry.
• Experience in road-mapping and strategy definition.
• Knowledge in semiconductor package engineering.
• Business risk and impact analysis.
• Capability in anticipate issues and challenges and resolving then quickly.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

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