Senior Staff Engineer Packing Power Modules (f/m/div)*

As a Senior Staff Engineer in Packing Power Modules at Infineon in Cegléd, Hungary, you will be a key player in development projects, focusing on packing requirements for new products. Your role involves developing technical specifications for new or modified internal and external packing materials, managing related projects, and coordinating with suppliers and internal teams. You will also qualify packing materials, coordinate documentation, and contribute to investigating customer claims. This position requires a proactive, innovative individual with strong analytical and problem-solving skills, eager to shape the future of cutting-edge semiconductor products in an advanced cleanroom environment.

Must Have

• Develop technical specifications for new or modified internal and external packing materials based on the requirements of the requestor
• Develop new packing materials and modify the existing designs
• Manage packing development projects topics
• Collate packing material concept with suppliers
• Collate suppliers concept with internal requestor, to request samples
• Qualify packing materials and having related tests made
• Coordinate compiling the related documentation, to coordinate introducing new packing materials
• Closely cooperate with the relevant departments, as Process Engineering, Procurement, Supplier Quality Management, Logistic to preparing packing related specification, instruction or modifying existing ones
• Actively contribute to investigating customers claims of packing materials, to work out and implement corrective actions
• Create and evaluate packing specification, design rule and requirements
• University Degree in Packing (Design), Light-Industry Engineering or Mechanical Engineering
• At least 1-year relevant experience in packing technology or development
• Basic knowledge of different technology of packing materials (injection molding, vacuum forming, paper cutting and perforation)
• Basic project management knowledge or willingness leading smaller projects

Perks & Benefits

• Career development & learning
• Time & flexibility
• Health & wellbeing
• Your working environment
• Rewards & benefits

#WeAreIn for jobs that impact everyone's life. As a Packing Development Engineer in a Engineer team, find yourself in a high-tech world where silicon wafers evolve into cutting-edge products. In our advanced cleanroom environment, every detail count, and your expertise will help shape the future, one innovation at a time. Are you in?

Your Role

As a Packing Development Engineer, you will participate in development projects, focusing on the packing requirements for new products/ modules

Key responsibilities in your new role

• Develop technical specifications for new or modified internal and external packing materials based on the requirements of the requestor
• Develop new packing materials and modify the existing designs
• Manage packing development projects topics
• Collate packing material concept with suppliers
• Collate suppliers concept with internal requestor, to request samples
• Qualify packing materials and having related tests made
• Coordinate compiling the related documentation, to coordinate introducing new packing materials
• Closely cooperate with the relevant departments, as Process Engineering, Procurement, Supplier Quality Management, Logistic to preparing packing related specification, instruction or modifying existing ones
• Actively contribute to investigating customers claims of packing materials, to work out and implement corrective actions
• Create and evaluate packing specification, design rule and requirements

Your Profile

You are a good team player and have an effective communication within cross functional teams. You’re highly innovative, motivated, and pro-active with strong analytic work methodology and a great set of problem-solving skills.

Qualifications and skills to help you succeed

• University Degree in Packing (Design), Light-Industry Engineering or Mechanical Engineering
• At least 1-year relevant experience in packing technology or development
• Basic knowledge of different technology of packing materials (injection molding, vacuum forming, paper cutting and perforation
• Basic project management knowledge or willingness leading smaller projects

Contact:

Petra.Kecskemeti@infineon.com, LinkedIn

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

**Are you in?

**Backend

The backend segments enable the development of comprehensive innovation across the entire value chain: starting with chip manufacturing, to wafer testing, preassembly, package development and development of new materials. The backend cluster combines the competencies for planning, productivity, innovation and quality, assembly and testing

**We are on a journey to create the best Infineon for everyone.

**This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more

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