Junior Engineer

5 Hours ago • All levels • $66,000 PA - $105,000 PA

Job Summary

Job Description

This position involves RF characterization of wireless handset chipsets. Responsibilities include coordinating with various teams to ensure RF end product reliability and quality. The role also involves troubleshooting, root cause analysis, and failure analysis of RF components. The engineer will define semiconductor device reliability requirements, evaluate and design reliability test hardware/software, and analyze data using software like JMP, including supervising technicians.
Must have:
  • BS in Computer Science/Engineering required
  • Legal right to work in the United States
  • Understanding of semiconductor device physics and reliability
Good to have:
  • Experience with semiconductor RF components
  • Familiarity with burn-in life test hardware development
  • Knowledge of Python and data visualization libraries
Perks:
  • Medical, dental and vision plans
  • 401(K) participation including company matching
  • Employee Stock Purchase Program (ESPP)
  • Employee Assistance Program (EAP)
  • Paid holidays, paid sick leave and vacation time

Job Details

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Job Description:

Junior Engineer

Job description

Job Overview 

This position is intended to help with the radio frequency (RF) characterization of the wireless handset chipsets, sold by Broadcom in 100s of millions globally each year. This function will serve R&D, design and quality teams.

The person is also responsible for coordinating with the R&D, process development, systems hardware engineering and the user experience teams to ensure that the RF end product meets the appropriate reliability & quality specs within the wireless division of Broadcom Inc. The person is also responsible for leading troubleshooting, root cause and failure analysis activity when necessary to resolve the device and reliability failures of RF components. 

The person should be well versed in New Technology and New Product Introduction, setting up reliability assessment Operations with detailed data analysis with JMP software, especially for semiconductor-related RF products. 

As a salary-based Staff (full time), this person will

  • Work closely with Design, Advanced Technology Research and Development, Fab and assembly Manufacturing to define semiconductor device reliability requirements, characterize the device reliability for state-of–the–art IC process and package technologies with detailed data analysis
  • Evaluation and design of reliability test hardware/software for dynamic life testing of semiconductor RF devices
  • Work closely with quality reliability engineers to define reliability assessment plans with detailed lab support and milestone 
  • Execute process and intrinsic device reliability qualification with various environmental chambers. Support and organize Rel test schedule, load/unload/clean, troubleshoot and daily operations.  Perform wafer level RF testing and ESD, power handling, thermal IR characterization with QFI instrument   
  • Carry out data analysis of design DOE with excel/JMP software and provide feedback to cross functional teams
  • Supervise technicians to coordinate, carry out and monitor progress on assigned reliability tasks by Engineer’s instructions 
  • Develop automation scrips to improve operational efficiency, data analysis, plot and reports; Dig deeper into the data: skilled in developing and maintaining SW modules for on-the-fly data analytics. Review/Present/Explain/Expand the system-generated plots and data visualizations

Requirements/Qualifications for the position:

  • BS in Computer Science / Engineering required
  • Candidate must have the legal right to work in the US
  • Electrical Engineering, Material Science, Solid State Physics or other engineering or technical disciplines.
  • Solid understanding from college courses in semiconductor device physics and device reliability physics, sound knowledge in semiconductor IC processing and assembly package technology.
  • College courses or experience, either in industry or research, in semiconductor device reliability characterization or IC processing, or package technology. Prior experience related to semiconductor RF components will be a plus 
  • Master of statistic data analysis- excel and JMP is a must
  • Familiar with burn-in life test hardware development like RF or DC HTOL, software coding for automation experience will be plus 
  • Good knowledge of Python. Familiarity with plotting, Pandas and dash libraries a plus. Help build a data visualization dashboard to report test results

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $66,000 - $105,000 

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

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A global infrastructure technology leader built on more than 60 years of innovation, collaboration and engineering excellence.

 

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