Package Design Engineer

undefined ago • 10 Years + • Software Development & Engineering • $141,300 PA - $226,000 PA

Job Summary

Job Description

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. The role involves overall design responsibility for ASIC package designs, including signal integrity, power integrity, manufacturability, reliability, and thermal aspects. The engineer will design critical structures for SerDes, ADC/DAC, and DDR, manage projects, and contribute to efficiency improvements. This position requires on-site work 5 days a week.
Must have:
  • Overall design responsibility for ASIC package designs, including signal integrity, power integrity, manufacturability, reliability, and thermal.
  • Package Design of critical structures for SerDes, ADC/DAC, DDR.
  • Schedule, prioritize, & track your work across 2+ projects simultaneously.
  • General flip-chip BGA package design & engineering.
  • Project management and customer interface for your design projects.
  • Contribute to efficiency improvements for the design team through process development/improvement, automation, documentation.
  • Physical design (layout) is a foundational responsibility in this role.
Good to have:
  • 1 or more years experience with Cadence SKILL for Allegro
  • Similar design-automation coding experience and interest
Perks:
  • Discretionary annual bonus
  • Equity
  • Medical plans
  • Dental plans
  • Vision plans
  • 401(K) participation including company matching
  • Employee Stock Purchase Program (ESPP)
  • Employee Assistance Program (EAP)
  • Company paid holidays
  • Paid sick leave
  • Vacation time
  • Paid Family Leave

Job Details

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and contribute to efficiency improvements for our design team.

RESPONSIBILITIES:

  • Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
  • Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.
  • Schedule, prioritize, & track your work across 2+ projects simultaneously
  • General flip-chip BGA package design & engineering
  • Project management and customer interface for your design projects
  • Contribute to efficiency improvements for the design team, through process development/improvement, automation, documentation, etc.
  • Physical design (layout) is a foundational responsibility in this role

EDUCATION/EXPERIENCE & REQUIREMENTS:

  • BSEE or similar field and 12+ years’ experience in flip-chip-BGA package design, including high-speed SerDes or MSEE or similar field and 10+ years’ work experience
  • Knowledge of package-level signal integrity and power integrity, to apply to package designs
  • Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.
  • Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
  • Self-management and organization skills
  • Preferred candidates will also have 1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest

OTHER REQUIREMENTS

  • This job requires working on-site at the office, 5-days a week. This is not a remote-work position

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About The Company

A global infrastructure technology leader built on more than 60 years of innovation, collaboration and engineering excellence.

 

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