Senior Manager, HBM, Product and Solution Planning

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What You’ll Do

Samsung Semiconductor, Inc. is looking for outstanding member in Product and Solution Planning to lead HBM architecting and planning with key partners & customers. This role will play an instrumental role in defining key features and architecture for Samsung’s standard and custom HBM, by identifying and analyzing AI driven memory requirements. He/she will then creatively combine the capabilities of Samsung’s industry leading semiconductor design, process and packaging technology to architect and deliver best-in-class HBM solution for the industry. He/she will also be leading strategic mid/long-term HBM roadmap planning with in-depth knowledge on memory technology and keen sense on industry & market trend.

Come to join the Product and Solution Planning team that consists of professionals who possess a fine mix of in-depth technical knowledge as well as business acumen.

Location: Hybrid, working onsite at our office 3 days per week with the flexibility to work remotely the remainder of your time

Reports to: SVP

• Understand memory requirements driven by latest AI applications and accelerators.
• Identify key technical elements (design/architecture/package, test and assembly) necessary for defining and productizing leading-edge HBM products.
• Communicate a product vision clearly to team members and key partners and inspire actions that lead to solid product definitions.
• Communicate constantly and clearly with key partners and customers to adapt to evolving product requirements.
• Derive key spec, features and high-level architecture of HBM products addressing market needs.
• Develop HBM product plans and roadmap by comprehending internal (senior cross-domain engineers) and external customer feedbacks and requirements.
• 15-20% travel required.

What You Bring

• BS in Computer/Electrical Engineering or Computer Science with 15+ years of working experiences in silicon development or MS in Computer/Electrical Engineering or Computer Science with 13+ years of relevant working experience or PhD and 10+ years of relevant working experience preferred.
• 10~15 years of direct work experience in DRAM/SoC design, architecture or product planning.
• Proven record of productization/commercialization of leading-edge semiconductor products.
• In-depth technical understanding on DRAM/SoC related protocols & PHYs, such as (not limited to) DDR/HBM(IO), AXI, PCIe/UCIe, etc.
• Good understanding in process, package and assembly technology & foundry/OSAT ecosystems.
• Solid/proven communication skill with globally located internal and external customers to comprehend varying requests and address potential issues.
• Experience in technical (design/architecture) or product planning for HBM, GPGPU or accelerator ASIC.
• Experience in building product strategy and plan for major memory or SoC manufacturers.
• Experience in managing full life cycle of leading edge semiconductor products (market research, spec definition, product development and customer engagement)
• Proven track record in product/program management.
• MBA/Korean language fluency is a plus
• You’re inclusive, adapting your style to the situation and diverse global norms of our people.
• An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
• You’re collaborative, building relationships, humbly offering support and openly welcoming approaches.
• Innovative and creative, you proactively explore new ideas and adapt quickly to change.

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