Senior Packaging Technical Engineer - Hardware

6 Months ago • 8-8 Years • $160,000 PA - $304,750 PA
Research Development

Job Description

As a Senior Packaging Technical Engineer at NVIDIA, you will define chip pad ring, substrate interconnect schemes, and lead package layout design. Collaboration with large teams (Circuit, Signal Integrity, RTL, Place and Route, substrate layout, and system design engineers) is crucial. Responsibilities include defining chip floor plan, pad ring, substrate, and ball-out, implementing robust electrical packages, and effectively communicating with various teams. This role requires a BSEE or equivalent experience and a minimum of 8 years in board/system design; package design experience is preferred.
Good To Have:
  • Cadence Skill
  • Excel familiarity
Must Have:
  • BSEE or equivalent
  • 8+ years board/system design
  • Package design experience
  • Transmission line theory understanding
  • Power delivery & signal integrity knowledge
  • Strong programming skills (Perl, Python, Tcl)
Perks:
  • Competitive salary
  • Generous benefits package
  • Equity

Add these skills to join the top 1% applicants for this job

deep-learning
python
perl
excel
communication

We are now looking for a Senior Packaging Technical Engineer. NVIDIA has continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI — the next era of computing.

NVIDIA is a “learning machine” that constantly evolves by adapting to new opportunities that are hard to solve, that only we can tackle, and that matter to the world. This is our life’s work , to amplify human imagination and intelligence. Make the choice to join us today.

What you’ll be doing:

  • Your responsibilities include defining the chip pad ring, substrate interconnect scheme, and lead the package layout design process.

  • We collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers.

  • Work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package!

  • Communicate effectively with various teams throughout the company

What we need to see:

  • BSEE or equivalent experience.

  • Minimum of 8+ years in board/system design. Experience with package design is preferred.

  • Good understanding of transmission line theory, power delivery and signal integrity is desired.

  • Strong programming and scripting skills in Perl, Python, Tcl desired, Cadence Skill and EXCEL familiarity are helpful.

  • Enthusiastic and able to work with a minimum of supervision.

  • You seek to solve complex technical problems.

With competitive salaries and a generous benefits package, NVIDIA is widely considered to be one of the technology world’s most desirable employers. We welcome you join our team with some of the most hard-working people in the world working together to promote rapid growth. Are you passionate about becoming a part of a best-in-class team supporting the latest in GPU and AI technology? If so, we want to hear from you.

The base salary range is 160,000 USD - 304,750 USD. Your base salary will be determined based on your location, experience, and the pay of employees in similar positions.

You will also be eligible for equity and benefits. NVIDIA accepts applications on an ongoing basis.

NVIDIA is committed to fostering a diverse work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.

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