Staff NPI Package Development Engineer
Job Summary
Job Description
Seeking a Staff Package Development Engineer in Edinburgh, UK, to develop advanced packaging solutions for high-performance products like amplifiers, codecs, and DSPs. Responsibilities include collaborating with cross-functional teams and suppliers, ensuring packages meet electrical, thermal, and mechanical requirements, and resolving packaging-related issues. The role involves working with customers to define design rules, developing test vehicles, and promoting automation. The ideal candidate will have a strong foundation in engineering fundamentals, FEA, and Six Sigma tools, with excellent communication and relationship-building skills. Experience in semiconductor manufacturing processes and various package types is preferred.
Must have:
- BS or above in Mechanical, Electrical, Chemical, or Materials Engineering
- Proven experience in a packaging-related field
- Foundation in Heat Transfer, Thermo-Mechanical Loading & Mechanics of Materials
- Knowledge/experience with FEA
- Knowledge/experience of material and/or process characterization
- Knowledge/experience with Six Sigma design & quality tools
- Strong written and verbal communication skills
- Self-starter with a strong sense of ownership
- Ability to build strong, influential relationships
Good to have:
- Solid understanding of backend semiconductor manufacturing processes
- Solid understanding of WLCSP & wire bond on QFN and substrate-based packages
- Understanding of package reliability tests and failure modes
- Familiarity with automotive package qualification requirements
- Experience with FEA tools (Ansys, IcePack)
- Experience with statistical/data analysis tools (JMP, R, Excel, MATLAB)
5 skills required
Job Details
Are you ready to make a significant impact in a fast-paced, innovative environment?
We are seeking a Staff Package Development Engineer to join our dynamic team in Edinburgh, UK. In this role, you’ll work closely with internal and external customers to develop cutting-edge packaging solutions for high-performance products including amplifiers, codecs, and DSPs. Our packaging technologies span from traditional wire-bond QFN to advanced WLCSP and flip-chip designs.
Responsibilities:
- Collaborate with cross-functional teams to drive package development for new products from early concept through qualification
- Cooperate frequently with domestic and overseas suppliers (manufacturing, materials, etc.)
- Ensure new and existing package solutions meet electrical, thermal, and mechanical requirements, as well as manufacturability and reliability standards
- Partner with customers, both internal and external, to establish and maintain design rules for all packaging technologies
- Develop experiments and test vehicles to evaluate and improve existing packaging technologies
- Help resolve packaging-related issues from product qualifications or the field
- Review manufacturing excursions and provide solutions to product and quality engineering teams, resulting in root cause and corrective actions
- Grow and promote automation processes throughout the package development flow
- Drive continuous improvement for systems and processes
Required Skills and Qualifications
- BS or above in Mechanical, Electrical, Chemical, or Materials Engineering
- Proven experience in a packaging-related field
- Foundation in fundamentals of Heat Transfer, Thermo-Mechanical Loading & Mechanics of Materials
- Knowledge/experience with FEA for mechanical and thermal analysis
- Knowledge/experience of material and/or process characterization
- Knowledge/experience with Six Sigma design & quality tools (Cp, Cpk, SPC, FMEA, 8D, 4D)
- Strong written and verbal communication skills; able to review technical ideas with customers and high-level management
- Self-starter with a strong sense of ownership and accountability for driving projects to completion
- Ability to build strong, influential relationships in a collaborative environment within a diverse setting
Preferred Skills and Qualifications:
- Solid understanding of backend semiconductor manufacturing processes including photolithography, metal plating, wire/die bonding, dicing, grooving, inspection, etc.
- Solid understanding of various package types, particularly WLCSP & wire bond on both QFN and substrate-based
- Understanding of package reliability tests (uHAST, bHAST, MSL, TCT, HTS) and their failure modes & requirements
- Familiarity with automotive package qualification requirements and standards (e.g., AEC-Q100, ISO 26262)
- Experience with FEA tools (Ansys, IcePack)
- Experience with statistical/data analysis tools (JMP, R, Excel, MATLAB)
This position is based in Edinburgh, UK
This is a hybrid remote position and will follow a 2+ day in-office work schedule, with in-office days based on business needs and team preference. You must be based within commutable distance of the work location listed on the job posting, or willing to relocate prior to beginning employment with Cirrus Logic.
#LI-PD1
#LI-Hybrid
At Cirrus Logic, we believe that diversity drives innovation, and we are committed to encouraging an open and collaborative culture where different approaches, ideas, and points of view are respected and valued. We aim to promote a workplace where everyone can contribute irrespective of race, colour, national origin, religion or belief, gender or gender identity, sexual orientation, age, marital status, pregnancy status, or disability.
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