Package Integration Engineer

About Celestial AI

As Generative AI continues to advance, the performance drivers for data center infrastructure are shifting from systems-on-chip (SOCs) to systems of chips. In the era of Accelerated Computing, data center bottlenecks are no longer limited to compute performance, but rather the system’s interconnect bandwidth, memory bandwidth, and memory capacity. Celestial AI’s Photonic Fabric™ is the next-generation interconnect technology that delivers a tenfold increase in performance and energy efficiency compared to competing solutions.

The Photonic Fabric™ is available to our customers in multiple technology offerings, including optical interface chiplets, optical interposers, and Optical Multi-chip Interconnect Bridges (OMIB). This allows customers to easily incorporate high bandwidth, low power, and low latency optical interfaces into their AI accelerators and GPUs. The technology is fully compatible with both protocol and physical layers, including standard 2.5D packaging processes. This seamless integration enables XPUs to utilize optical interconnects for both compute-to-compute and compute-to-memory fabrics, achieving bandwidths in the tens of terabits per second with nanosecond latencies.

This innovation empowers hyperscalers to enhance the efficiency and cost-effectiveness of AI processing by optimizing the XPUs required for training and inference, while significantly reducing the TCO2 impact. To bolster customer collaborations, Celestial AI is developing a Photonic Fabric ecosystem consisting of tier-1 partnerships that include custom silicon/ASIC design, system integrators, HBM memory, assembly, and packaging suppliers.

ABOUT THE ROLE

Systems and Packaging group is hiring a Package Integration Engineer to oversee packaging integration and vendor coordination from design to manufacturing. They'll define day-to-day priorities, guide build plans, drive yield improvement, and ensure smooth project execution.

ESSENTIAL DUTIES AND RESPONSIBILITIES

• Work with cross-functional teams to coordinate package integration, design, manufacturing and reliability efforts of test vehicles and product builds
• Work with OSAT (Outsourced Semiconductor Assembly and Test) and other 3rd party vendors to bring product from concept to NPI (New Product Introduction) and HVM (High-Volume Manufacturing)
• Align day-to-day activities of individual contributors and managers and track progress in project and document management software
• Use DOE (Design of Experiment) principles and engineering judgement to propose and manage material build plans to support process development, material selection, bringup, test, and reliability efforts
• Analyze manufacturing data (inline monitors, test, third party updates) to provide source-of-truth reports on yield, failure modes and development progress
• Participate in and support path-finding activities in package assembly and test

QUALIFICATIONS

• MS in physical sciences/engineering and 10+ years of relevant industry experience
• Exposure to full product life cycle (end to end)
• Experience in working with third party foundries and/or OSATs

PREFERRED QUALIFICATIONS

• Advanced degree in science or engineering fields
• Understanding of cross-functional packaging areas (floor plan, layout and architecture, process, thermal, mechanical, SI/PI, testing, and FA)
• Demonstrated technical judgement in context of assemblies of various form factors, thermo-mechanical, reliability, and cost constraints
• Familiarity with optical packaging
• Familiarity with systems engineering procedures
• Previous experience with Atlassian Jira/Confluence systems
• Previous experience with data analysis in JMP/Py/R
• Excellent problem solving and communication skills

For California Location:

As an early stage start up, we offer an extremely attractive total compensation package inclusive of competitive base salary, bonus and a generous grant of our valuable early-stage equity. The base salary offered may be slightly higher or lower than the target base salary, based on the final scope as determined by the depth of the experience and skills demonstrated by candidate in the interviews.

We offer great benefits (health, vision, dental and life insurance), collaborative and continuous learning work environment, where you will get a chance to work with smart and dedicated people engaged in developing the next generation architecture for high performance computing.

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