This is an outstanding hardware design position with participation in the development of new technologies for rigid, flex, and substrate PCB designs across iPhone products. The role involves close collaboration with key cross-functional partners in San Diego. Key responsibilities include developing technology solutions at the PCB/module level to meet product goals in terms of cost, thermal performance, battery life, reliability, and environmental impact. The role also involves collaborating with technology teams to explore process improvements and materials that enable reductions in routing density, power loss, coexistence, and insertion loss, while maintaining or reducing solution dimensions. The engineer will contribute to cross-functional system and module designs across antenna flexes, camera substrates, MLB PCBs, and system flexes. There will also be opportunities for international travel.