<p>Wolters Kluwer (EURONEXT: WKL) is a global leader in professional information, software solutions, and services for the healthcare, tax and accounting, financial and corporate compliance, legal and regulatory, and corporate performance and ESG sectors. We help our customers make critical decisions every day by providing expert solutions that combine deep domain knowledge with specialized technology and services. &nbsp;</p><p>Wolters Kluwer reported 2022 annual revenues of €5.5 billion. The group serves customers in over 180 countries, maintains operations in over 40 countries, and employs approximately 20,000 people worldwide. The company is headquartered in Alphen aan den Rijn, the Netherlands.</p>

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We are looking for a visionary and user-centric Product Manager to lead the development of a unified Platform UX and Home Experience for Enablon’s integrated risk and sustainability platform. This role is central to shaping how users interact with our ecosystem. You will define and deliver a seamless, intelligent, and outcome-driven user experience that supports both traditional UI patterns and emerging AI-driven interactions, including navigation, notifications, search, and analytics, anchored in Jobs to Be Done and user outcomes.

Senior Inside Sales Representative *Software* Hybrid

<h2 class="text-2xl md:text-3xl font-bold mt-10 mb-4 border-b pb-2 text-gray-800">About the Role</h2><p class="my-4 text-gray-700 leading-relaxed">We are looking for a visionary and user-centric Product Manager to lead the development of a unified Platform UX and Home Experience for Enablon’s integrated risk and sustainability platform. This role is central to shaping how users interact with our ecosystem. You will define and deliver a seamless, intelligent, and outcome-driven user experience that supports both traditional UI patterns and emerging AI-driven interactions. This includes navigation, notifications, search, and analytics, anchored in Jobs to Be Done and user outcomes.</p><h2 class="text-2xl md:text-3xl font-bold mt-10 mb-4 border-b pb-2 text-gray-800">Key Responsibilities</h2><ul class="list-disc list-inside my-5 pl-5 space-y-2 text-gray-700"><li class="leading-relaxed">Define the vision and roadmap for a centralized home experience that unifies access to platform capabilities across risk, ESG, and sustainability domains.</li><li class="leading-relaxed">Champion a conversational interface that intelligently routes user intents to the right services and agents.</li><li class="leading-relaxed">Collaborate with UX designers and researchers to ensure the experience is intuitive, accessible, and aligned with user needs.</li><li class="leading-relaxed">Drive the integration of traditional UI elements (e.g. navigation, notifications, search) with AI-driven interactions.</li><li class="leading-relaxed">Ensure users can easily access, interpret, and act on data through embedded analytics and contextual insights.</li><li class="leading-relaxed">Partner with the Data and domains PMs to surface meaningful metrics and visualizations that support decision-making.</li><li class="leading-relaxed">Align with engineering, design, and customer success teams to deliver high-quality, user-validated features.</li><li class="leading-relaxed">Define how the orchestrator agent interacts with platform and domain-specific agents to fulfill user intents.</li><li class="leading-relaxed">Ensure the system is extensible, secure, and capable of supporting evolving AI capabilities.</li></ul><h2 class="text-2xl md:text-3xl font-bold mt-10 mb-4 border-b pb-2 text-gray-800">Qualifications</h2><ul class="list-disc list-inside my-5 pl-5 space-y-2 text-gray-700"><li class="leading-relaxed">5+ years in product management, with a focus on UX, platform experiences, or AI-driven interfaces.</li><li class="leading-relaxed">Experience in enterprise SaaS, ideally in risk, compliance, or sustainability domains.</li><li class="leading-relaxed">Strong understanding of UX principles, user research, and interaction design.</li><li class="leading-relaxed">Familiarity with AI/ML concepts, conversational interfaces, and agent-based architectures.</li><li class="leading-relaxed">Experience with analytics platforms and data visualization tools is a plus.</li><li class="leading-relaxed">Empathetic and user-obsessed mindset with strong storytelling and communication skills.</li><li class="leading-relaxed">Ability to translate complex technical concepts into intuitive user experiences.</li><li class="leading-relaxed">Comfortable working in a fast-paced, cross-functional environment.</li></ul><h2 class="text-2xl md:text-3xl font-bold mt-10 mb-4 border-b pb-2 text-gray-800">Why Join Us</h2><p class="my-4 text-gray-700 leading-relaxed">At Enablon, we’re reimagining how users engage with risk and sustainability data. This role offers a unique opportunity to shape the front door to our platform, empowering users through intelligent, personalized, and outcome-driven experiences.</p><p class="my-4 text-gray-700 leading-relaxed">Applicants may be required to appear onsite at a Wolters Kluwer office as part of the recruitment process.</p>

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<p>- This assessment gives us an idea of your C++ skills<br>- Companies that evaluate this skillset in interviews: <strong>Rockstar Games, Ubisoft, Mayhem Studios, etc.</strong><br>- 10 Multiple Choice questions<br>- Average time to complete: <strong>7 to 10 minutes</strong></p>

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Celestial AI

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Celestial AI is seeking a 2.5D/3D Process Development Engineer to drive AI products from concept to high-volume manufacturing. This role involves utilizing in-depth 2.5D assembly process experience and partner management to lead assembly process technology development in close collaboration with foundries and OSATs. The engineer will ensure design for manufacturing, reliability, and cost, manage package qualification, and innovate advanced package solutions, requiring hands-on experience in TSV and 2.5D/3D CoW assembly development.

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<h1 class="text-3xl md:text-4xl font-extrabold mt-6 mb-4 text-gray-900 tracking-tight">About Celestial AI</h1><p class="my-4 text-gray-700 leading-relaxed">As Generative AI continues to advance, the performance drivers for data center infrastructure are shifting from systems-on-chip (SOCs) to systems of chips. In the era of Accelerated Computing, data center bottlenecks are no longer limited to compute performance, but rather the system’s interconnect bandwidth, memory bandwidth, and memory capacity. Celestial AI’s Photonic Fabric™ is the next-generation interconnect technology that delivers a tenfold increase in performance and energy efficiency compared to competing solutions.</p><p class="my-4 text-gray-700 leading-relaxed">The Photonic Fabric™ is available to our customers in multiple technology offerings, including optical interface chiplets, optical interposers, and Optical Multi-chip Interconnect Bridges (OMIB). This allows customers to easily incorporate high bandwidth, low power, and low latency optical interfaces into their AI accelerators and GPUs. The technology is fully compatible with both protocol and physical layers, including standard 2.5D packaging processes. This seamless integration enables XPUs to utilize optical interconnects for both compute-to-compute and compute-to-memory fabrics, achieving bandwidths in the tens of terabits per second with nanosecond latencies.</p><p class="my-4 text-gray-700 leading-relaxed">This innovation empowers hyperscalers to enhance the efficiency and cost-effectiveness of AI processing by optimizing the XPUs required for training and inference, while significantly reducing the TCO2 impact. To bolster customer collaborations, Celestial AI is developing a Photonic Fabric ecosystem consisting of tier-1 partnerships that include custom silicon/ASIC design, system integrators, HBM memory, assembly, and packaging suppliers.</p><h1 class="text-3xl md:text-4xl font-extrabold mt-6 mb-4 text-gray-900 tracking-tight">ABOUT THE ROLE</h1><p class="my-4 text-gray-700 leading-relaxed">In this role you will utilize your in-depth 2.5D assembly process experience and partner management experience to drive company’s AI products from concept to high volume manufacturing. You will be responsible for managing and driving the assembly process technology development in close collaboration with foundries and OSATs to ensure design for manufacturing, reliability, and cost. Responsibilities will include identification and mitigation of risk to new technologies used in product integration and ensure factory readiness through maturing product during the NPI phase. This job will require you to have hands-on experience in TSV and wafer process development, 2.5D/3D CoW assembly development along with strong project management, written and verbal communication skills as well as a can-do attitude to prioritize and address issues with a high sense of urgency.</p><h1 class="text-3xl md:text-4xl font-extrabold mt-6 mb-4 text-gray-900 tracking-tight">ESSENTIAL DUTIES AND RESPONSIBILITIES</h1><ul class="list-disc list-inside my-5 pl-5 space-y-2 text-gray-700"><li class="leading-relaxed">Work with cross-functional packaging teams and lead TSV, backend stack development at the foundry along with 2.5D/3D CoW process development at OSATs to bring packaging solutions from concept to prototypes and ramp to high volume manufacturing with aggressive cost reduction strategies</li><li class="leading-relaxed">Actively manage qualification of packages with sensitivity to physics of failures for high thermo-mechanical reliability, while operating within established cost constraints</li><li class="leading-relaxed">Manage internal and external resources effectively and efficiently towards established corporate milestones</li><li class="leading-relaxed">Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Celestial AI</li></ul><h1 class="text-3xl md:text-4xl font-extrabold mt-6 mb-4 text-gray-900 tracking-tight">QUALIFICATIONS</h1><ul class="list-disc list-inside my-5 pl-5 space-y-2 text-gray-700"><li class="leading-relaxed">10+ years of experience in Semiconductor Packaging, Process and Technology Development</li><li class="leading-relaxed">Expert level understanding of advanced foundry process node and its interaction with Packaging/assembly/substrate across various package technologies is required</li><li class="leading-relaxed">Expertise in advanced packaging technologies: knowledge and insight to deliver high density/high performance interconnects with TSVs in various 2.5D/3D package form factors</li><li class="leading-relaxed">Proven track record of bringing products from Technology development, package design/definition, qualification, NPI through HVM is required</li><li class="leading-relaxed">Working level understanding of cross-functional packaging areas: package architecture, design rules, BOM, enabling material/process technologies, mechanical, design for manufacturing, reliability, and cost</li><li class="leading-relaxed">Familiarity with component & system level reliability, testing, and FA</li><li class="leading-relaxed">Experience with photonics packaging will be preferred but is not necessary</li><li class="leading-relaxed">Experience in project management and communicating technical and project/program status and issue resolution at the executive level</li><li class="leading-relaxed">Excellent problem-solving skills with strong fundamentals in science, sound engineering judgment, and analytical ability</li><li class="leading-relaxed">Effective communicator and comfortable engaging with internal cross functional teams as well as domestic and overseas suppliers</li><li class="leading-relaxed">Excellent attention to detail, process and operationally oriented and self-driven with the ability to work independently and take projects to completion with minimum supervision</li><li class="leading-relaxed">M.S or Ph.D. in Mechanical Engineering, Materials Science or Physics is required</li></ul><p class="my-4 text-gray-700 leading-relaxed">For California Location:</p><p class="my-4 text-gray-700 leading-relaxed">As an early stage start up, we offer an extremely attractive total compensation package inclusive of competitive base salary, bonus and a generous grant of our valuable early-stage equity. The target base salary for this role is approximately $195,000.00 - $225,000.00. The base salary offered may be slightly higher or lower than the target base salary, based on the final scope as determined by the depth of the experience and skills demonstrated by candidate in the interviews.</p><p class="my-4 text-gray-700 leading-relaxed">We offer great benefits (health, vision, dental and life insurance), collaborative and continuous learning work environment, where you will get a chance to work with smart and dedicated people engaged in developing the next generation architecture for high performance computing.</p><p class="my-4 text-gray-700 leading-relaxed">Celestial AI Inc. is proud to be an equal opportunity workplace and is an affirmative action employer.</p><p class="my-4 text-gray-700 leading-relaxed">#LI-Onsite</p>

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This assessment gives us an idea of your C++ skills- Companies that evaluate this skillset in interviews: Rockstar Games, Ubisoft, Mayhem Studios, etc.- 10 Multiple Choice questions- Average time to complete: 7 to 10 minutes

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Data Structures and Algorithms

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Programming Patterns

Let's assess your OOPs skills! ????- This assessment gives us an idea of your fundamental OOPS concepts and Solid principles skills- Companies that evaluate this skillset in interviews: Hitwicket, GSN Games, Tomo Club, etc.

Object Oriented Programming

Let's assess your Unity Skills ????- This assessment gives us an idea of your Unity fundamentals- Companies you can apply for after taking this assessment: Godspeed games, Salvation Games, nCore Games, etc.