Senior Staff Analog/Mixed-Signal Design Engineer - RF/SiPho/TIA/CMOS/SiGe

About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

Marvell's Broadband Analog group designs physical layer ICs for high-speed optical fiber data communication, such as Transimpedance Amplifiers (TIAs), and drivers for Silicon Photonic (SiPho), Electro-absorption Modulators (EAMs), and Mach-Zehnder Interferometer Modulators (MZMs). This group is the market leader in delivering TIAs and Drivers for Data Center and Telecom markets. We address the bandwidth, capacity and power issues faced by cloud computing and mega data center networks. Our world class group leverages our core competencies in advanced circuit design to solve the world’s ever-increasing desire to transmit more data for less power with fewer errors. We are continually first to market in Data Center, Metro and Long-Haul applications. As a member of the design group, the candidate will be responsible for design and validation of FET and BiCMOS circuits for high-speed broadband ICs that serve these applications.

What You Can Expect

Marvell is seeking an RF and Analog Design Engineer to contribute to the development of multi-tens of GHz transimpedance amplifiers (TIAs). These optical interface chips are tightly coupled with our high-performance equalizers. The results of our innovative designs have made our TIAs best in class for coherent long-haul and metro systems as well as PAM4 data center systems. In this role you will be responsible for:

• Active-circuit design.
• Design of leading edge transimpedance amplifiers, using both SiGe BiCMOS and the most advanced CMOS FinFET technologies, where circuit performance will need to transcend beyond industry leading products.
• Development of transmission line structures and other millimeter wave structures to enable higher performance than would normally be achievable.
• Design of high-performance broadband analog circuits for optical front-end receivers.
• Design of various other analog circuits including linear regulators, AGC loops, current/voltage sensors, bandgaps etc.
• Work with other functional groups to facilitate post-silicon validation, qualification, transition to mass production, and customer support.

What We're Looking For

• Bachelor’s degree in Electrical Engineering with 5+ years of industry experience OR Master’s or PhD degree in Electrical Engineering with 3+ years of industry experience in the area of designing high-performance RF/Analog Receiver/TIA.
• Proven experience in high-performance receiver design including both chip tape-out AND lab evaluation.
• Solid experience in.
• Using EDA CAD tools
• Performing Analog Custom Layout
• Experience in measuring IC performance and debug of design to correlate simulations to measurements.
• Deep understanding of fundamentals, including:
• Detailed transistor level design.
• Device physics.
• Control/Feedback loop stability analysis.
• Direct project experience in at least one of the following areas is a plus:
• Automatic gain-control loops.
• High precision analog circuits including linear regulators, current sensors, bandgaps and DAC/ADC.
• Continuous-time linear equalizers.
• Experience in Package-System integration issues is desired.
• Project experience in using different technologies. (SiGe BiCMOS and FinFET CMOS are pluses)
• A team-player.
• Experience in the following is a plus:
• Overseeing and mentoring junior circuit designers.
• Experience as chip lead with success in silicon.
• Experience in taking chips to mass production.
• Ability to translate chip level specifications into architecture.
• Strong communication, presentation and documentation skills.