NPI Process Engineer

1 Month ago • 5-8 Years • Software Development & Engineering

Job Summary

Job Description

The NPI Process Engineer will be responsible for supporting new package development processes in automotive applications. This includes ensuring quality, yield, cost, and process improvements. The engineer will also be in charge of process documentation, specifications, standard work instructions, and OCAP. Collaboration with cross-functional teams to resolve conflicts and make quick decisions is crucial. The role requires taking ownership and working closely with upper management to align project scope and direction.
Must have:
  • Bachelor's Degree in Engineering (Material Science/Electrical/Mechanical or equivalent).
  • 5-8 years of experience with semiconductor assembly background for automotive customers.
  • Good technical knowledge and hands-on experience in semiconductor manufacturing processes.
Good to have:
  • Experience in MAPBGA, SiP, FCCSP, FCBGA packing development is a plus.
  • Good SPC, Process Control, and other relevant statistical & problem-solving skills.
  • Proficiency in Microsoft applications (PowerPoint, Excel Macro, Word, etc.).

Job Details

•Responsible for supporting New Package development of processes in automotive applications.

•Responsible for quality, yield, cost and process improvement activities.

•Responsible for process documentation, process spec, standard work instruction, OCAP, Lead  etc.

•Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer.

•Take ownership to work closely with upper management to align scope and direction of key projects.

Qualification

•Candidate must possess at least a Bachelor's Degree in Engineering (Material Science/Electrical/Mechanical or equivalent).

•5-8 years of work experience with semiconductor assembly background for automotive customers.

•Experience in MAPBGA, SiP, FCCSP, FCBGA etc. packing development will be an added advantage.

•Good technical knowledge and hands-on experience in semiconductor manufacturing processes, such as saw, die bond, wire bonding, mold, ball attach, marking, singulation etc.

•Candidate must have great interpersonal skills, leadership skills, positive minded, self-driven and eager to strive for success.

•Good SPC, Process Control and other relevant statistical & problem-solving skills

Good in Microsoft application (PowerPoint, Excel Macro, Word, etc.). Project management knowledge is an added advantage


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About The Company

NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer, and more sustainable world through innovation. As the world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. For more information, visit www.nxp.comRead MoreCareer Development OpportunitiesBright Minds. Bright Futures.We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills.Read MoreCommitment At NXP.We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future.

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