Senior III-V Integration Engineer

This position is for a Lead Process Transfer Engineer role. The ideal candidate will possess a strong understanding of III-V compound semiconductor development cycles and fabrication processes, along with a solid technical foundation in optics, materials science, and electronics. The engineer will play a pivotal role in the technology transfer of qualified processes to a partner fabrication facility, collaborating with device, reliability and operation teams to ensure key performance, reliability, yield and efficiency targets are met in high-volume manufacturing environments. This individual will hold substantial day-to-day responsibilities in managing the partner site to ensure alignment with project timelines and fulfillment of product requirements. Key responsibilities include, but are not limited to: - Oversee tool installation, setup, overall fabrication readiness, and process bring up - Collaborate with internal development teams to ensure tool and process matching at the partner fabrication facility and identify any gaps - Demonstrate the viability of the baseline process flow in the MP-intent environment - Communicate with both upstream and downstream supply chain partners to establish OQC/IQC requirement and ensuring good handshake between the nodes - Drive execution at the partner facility to ensure timely delivery of in-spec components that support system builds and program milestones. In addition, the engineer will be responsible for leading technical reviews with internal teams and external partners to assess manufacturing readiness, identify potential risks, and collaborate to empower internal teams to resolve critical technical challenges to ensure process stability at the partner fabrication facility. The role also requires regular reporting and communication of key progress updates, technical findings, issue resolutions, and escalation items to multi-functional stakeholders and senior leadership on a weekly basis. Given the fabrication-focused nature of the role, frequent travel to the partner facility is expected, requiring a minimum of 30% travel time.