Staff NPI Package Design Engineer
Job Summary
Job Description
Seeking a Staff Package Design Engineer in Edinburgh, UK, to develop cutting-edge packaging solutions for high-performance products like amplifiers, codecs, and DSPs. Responsibilities include collaborating with cross-functional teams to define package requirements from electrical, thermal, and mechanical perspectives. You will utilize tools like AutoCAD, GDS, Siemen Fast3D, and Cadence SiP Layout for physical design, simulation, and validation. The role involves driving continuous improvement, establishing design rules for various package types, and understanding DFM to enhance assembly yield. You will also develop test vehicles to assess performance impacts and resolve design issues with customers.
Must have:
- BS or above in Engineering
- Packaging-related experience
- Experienced Cadence SiP layout user
- Strong AutoCAD user
- Knowledge of packaging technologies
- Understanding of electrical simulation results
- Strong communication skills
- Self-starter
- Ability to build strong relationships
Good to have:
- PCB and Die mechanical layout tools
- Broad technical reading
- Electrical simulation skills
- Experience using Siemens Fast 3D
- Experience using Siemens Calibre DRV
4 skills required
Job Details
Are you ready to make a significant impact in a fast-paced, innovative environment?
We are seeking a Staff Package Design Engineer to join our dynamic team in Edinburgh, UK. In this role, you’ll work closely with internal and external customers to develop cutting-edge packaging solutions for high-performance products including amplifiers, codecs, and DSPs. Our packaging technologies span from traditional wire-bond QFN to advanced WLCSP and flip-chip designs.
Responsibilities:
- Collaborate with cross-functional teams to drive package designs that meets Cirrus performance, reliability, and manufacturability requirements
- Define package requirements from electrical, thermal, and mechanical point of view in close cooperation with Design and layout teams
- Utilize AutoCAD, GDS tools, Siemen Fast3D and Cadence SiP Layout tool to complete physical design, electrical simulation and manufacturing validation solution for package design, including die bump array/BGA integration refinement using die information
- Drive continuous improvement processes to assure accuracy between the interface of the package to the die and PCB
- Work with cross functional teams (Customer, Designers, OSATs) to establish and maintain design rules for WLCSP, wire bond, and other packages
- Understand DFM checking and modification to improve assembly yield and prevent manufacturing issues
- Grow and promote automation processes throughout the package design flow
- Develop test vehicles that properly assess bump placement, PCB proximity effects, WLCSP RDL stack up and the like on final chip performance
- Close collaboration with customers to resolve various design issues between the piece part and PCB
Required Skills and Qualifications:
- BS or above in Mechanical, Electrical, Chemical, or Materials Engineering
- Demonstrable experience in a packaging-related field
- Experienced Cadence SiP layout user
- Strong AutoCAD user
- Knowledge of packaging technologies, materials, package substrate design and assembly rules
- Understanding of electrical simulation results on a package design
- Familiarity or willingness to learn Cadence Virtuoso operation using Unix workstations
- Strong written and verbal communication skills; able to review technical ideas with customers and high-level management
- Self-starter with a strong sense of ownership and accountability for driving projects to completion
- Ability to build strong, influential relationships in a collaborative environment within a diverse setting
Preferred Skills and Qualifications:
- Conversant with PCB and Die mechanical layout tools (e.g. Siemens Xpedition, Allegro PCB, Cadence Virtuoso)
- Broad reading in the area of interest and the desire to continue that reading with access to the high quality company library resource, material properties knowledge
- Must be broadly curious and knowledgeable, and willing to pursue mastery of new technical concepts through self-learning or training opportunities available through company resources
- Electrical simulation skills
- Experience using Siemens Fast 3D
- Experience using Siemens Calibre DRV
This position is based in Edinburgh, UK
This is a hybrid remote position and will follow a 2+ day in-office work schedule, with in-office days based on business needs and team preference. You must be based within commutable distance of the work location listed on the job posting, or willing to relocate prior to beginning employment with Cirrus Logic.
#LI-PD1
#LI-Hybrid
At Cirrus Logic, we believe that diversity drives innovation, and we are committed to encouraging an open and collaborative culture where different approaches, ideas, and points of view are respected and valued. We aim to promote a workplace where everyone can contribute irrespective of race, colour, national origin, religion or belief, gender or gender identity, sexual orientation, age, marital status, pregnancy status, or disability.
Similar Jobs
Sonar Source
Austin, Texas, United States (On-Site)
• 2 Months ago
Get notifed when new similar jobs are uploaded
Similar Skill Jobs
Boomi
Vancouver, British Columbia, Canada (Hybrid)
• 2 Weeks ago
Get notifed when new similar jobs are uploaded
Jobs in Edinburgh, Scotland, United Kingdom
Clearwater Analytics
London, England, United Kingdom (On-Site)
• 2 Years ago
Saviynt
London, England, United Kingdom (On-Site)
• 1 Month ago
Diligent Corporation
London, England, United Kingdom (Hybrid)
• 1 Month ago
Get notifed when new similar jobs are uploaded
Software Development & Engineering Jobs
whoop
Boston, Massachusetts, United States (On-Site)
• 3 Months ago
bytedance
Kulai, Johor, Malaysia (On-Site)
• 7 Months ago
Marvell
Santa Clara, California, United States (On-Site)
• 2 Months ago
Get notifed when new similar jobs are uploaded
