Advanced Packaging Flagship Curriculum Internship Program

1 Month ago • All levels

Job Summary

Job Description

This internship program is designed for undergraduate students enrolled in the Advanced Packaging Flagship Curriculum and is a required part of the USM academic plan. Responsibilities and scopes can be diverse depending on the assigned function or project. Participants will gain industrial exposure and technical skills to enhance their knowledge and experience for future career pursuits. Intel, as the world's largest chip manufacturer, focuses on state-of-the-art semiconductor manufacturing processes, including development, manufacturing, yield improvement, packaging, final test, optimization, and supply chain support.
Must have:
  • Must be an undergraduate student
  • Must be enrolled in Advanced Packaging Flagship Curriculum
  • Required to undergo internship by USM academic plan

Job Details

Job Details:

Job Description: 

Responsibilities and scopes may be quite diverse depending on the function or project assigned. The industrial exposure and technical skill learned will enhance the students' knowledge and experience for their future career undertaking.

Qualifications:

This internship is only open for the undergraduate student who has taken the Advanced Packaging Flagship Curriculum and required to undergo the internship program by USM academic plan.

          

Job Type:

Student / Intern

Shift:

Shift 1 (Malaysia)

Primary Location: 

Malaysia, Penang

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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