Job Details:
Job Description:
Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.
Intel Foundry will be differentiated from other foundries with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe, and a world-class IP portfolio that customers can choose from, including x86 cores, graphics, media, display, AI, interconnect, fabric and other critical foundational IP's, along with Arm and RISC-V ecosystem IP's. Foundry Services will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions, using industry standard design packages. The Package and Test Business Group (PBG) team supports commercial and technical alignments for Package Assembly and Test with foundry customers. Come join us and do something wonderful.
The Advanced Packaging Market Manager‘s responsibilities will include but not limited to:
- Drive complex business transactions from deal conception and negotiations to contract closure with companies which positively and significantly impact the business bottom line and/or competitive position.
- Contribute to business strategy development or other strategic projects as appropriate.
- Develop business relationships with third parties to understand the business and technical requirements.
- Work closely with internal development teams to guide business unit platform/product portfolios, accomplishing business unit strategic objectives.
- Conducts industry and market research to make build, buy, or partner recommendations to the leadership team.
- Build the business case to justify potential strategic partnerships and corporate transactions.
- Partners with cross-functional teams, to evaluate and drive strategic thinking on expansion opportunities.
- Identifies opportunities that support strategic priorities by interacting with senior business leaders, software companies, and organic pipeline generation.
- Ability to work independently in a highly matrixed structure.
Qualifications:
The Minimum qualifications and are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- Bachelor's degree in Finance, Electrical Engineering, Computer Engineering, Computer Science, Math or in a STEM related field of study.
- 6+ years of experience in microelectronic packaging or related fields.
- 3+ years of experience and interaction with leading Semiconductor players OSAT partners including products packaging trends and/or leading player package roadmaps.
Preferred Qualifications
- Post Graduate in Finance, Electrical Engineering, Computer Engineering, Computer Science, Math or in a STEM related field of study.
- Experience in OSAT-Semiconductor customer interface.
- Experience in packaging disciplines, die prep, assembly, sort, and test technology and manufacturing.
- Experience presenting to Senior Management (VP and Corporate VP Level).
- Experience in supply chain management and/or commercial contracts.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, California, Santa Clara
Additional Locations:
US, Arizona, Phoenix, US, Oregon, Hillsboro
Business group:
Intel Foundry is dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. As stewards of Moore's Law, we innovate and foster collaboration within an extensive partner ecosystem to advance technologies and enable our customers to design leadership products. Our strategic investments in geographically diverse manufacturing capacities bolster the resilience of the semiconductor supply chain. Leveraging our technological prowess, expansive manufacturing scale, and a more sustainable supply chain, Intel Foundry empowers the world to deliver essential computing, server, mobile, networking, and automotive systems for the AI era. This position is part of the Foundry Services business unit within Intel Foundry, a customer-oriented service organization that is dedicated to the success of its customers with full P&L responsibilities. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003
Annual Salary Range for jobs which could be performed in the US:
$179,880.00-$253,940.00Salary range dependent on a number of factors including location and experience.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.