Automotive NPI-Packaging Engineer, up to Sr. Staff

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Qualcomm Overview:

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.

General Summary:

Automotive Packaging NPI team Engineer needed to support Qualcomm's Automotive business and product technology development. The primary focus of this role is to support Qualcomm's Automotive business and product technology development. This role will be expected to serve as a product development engineer (risk identification, mitigation, and on time delivery of product assembly/mfg controls) and to eventually develop/manage a supporting packaging team in TW to manage suppliers. Work closely with US based automotive product, design, business, and various engineering teams in San Diego but focus will be support in Asia time zone adjacent to Qualcomm’s supply base. Must be capable of driving tech development for product by working with internal design teams and working in close collaboration with suppliers located worldwide (primarily Asia). Must be able to support clear messaging to the customer/internally in tech support activities.

Responsibilities: 
- Responsible for exploring, defining business justification, development and HVM deployment of Automotive Package and Module packaging technologies.
- Responsible for defining package assembly process flow, material set, test vehicle, DOEs, process control plans to successfully develop manufacturable and reliable Chipset/Module products.
- Interface with OSATs/CMs and component suppliers in developing technology related to OSAT/SiP product requirements. Align with internal product teams.
- Work with internal design team and drive DFM methodology for new technologies. Support and maintain internal assembly FMEA for product development.
- Work with internal design, modeling and procurement teams to implement technically best and lowest cost packaging options.
- Technical program management to plan, execute, and monitor complex process or product developments. Regular updates on program status to management.

- Responsible for leading programs/initiatives working with US staff and ultimately management and growth of a team in Taiwan to support automotive NPI and HVM sustaining activities (working closely with Operations team members in Asia) 

Additional Job Description

Minimum Qualifications:

- Bachelor's degree in Materials Science and/or Mechanical Engineering and/or Chemical Engineering
- 5+ years Hardware and/or Packaging/Module NPI experience or related work experience.

- Strong written/verbal English language skills and close prior experience working international team members.

Preferred Qualifications:

- Experience with semiconductor packaging, SIP/Module packaging, manufacturing process experience with wafer processing, Flipchip, wirebond, Underfill, Molding, SMT and other semiconductor packaging technologies.
- Experience working with OSATs, suppliers, internal design and product teams.
- Experience with new product development in electronic packaging, exposure to design and characterization techniques, DFM methodology, design of experiments and statistical data analysis.

- Automotive experience with IC Packaging, Module Packaging, and/or ECU Hardware development

- Prior management or team leadership experience (+3 years)

- In addition to Mandarin and English, language proficiency in Korean and/or Vietnamese

- Previous expat experience in US/UK

Education Qualifications:

Required: Bachelor's in Materials Science and/or Mechanical Engineering and/or Chemical Engineering
Preferred: Master's or PhD, Industrial Engineering, Materials Science and/or Mechanical Engineering and/or Chemical Engineering

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail myhr.support@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities.

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