Job Details:

Job Description: 

The position is for Package Module Development Engineer for die attach module in Assembly and Test Technology Development (ATTD) as part of ATTD in Asia initiative. The candidate will define and establish process flow, procedures, and equipment configuration for NPI products. Selects and develops material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Plans and conducts experiments to fully characterize the process throughout the development cycle. Drives improvements on quality, reliability, cost, yield, process stability/proficiency, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel. Develops solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools. Establishes process control systems for the process module and sustains the module through volume ramp. Develops strategy to resolve difficult problems and establishes systems to deal with these problems in the future. Trains production/receiving process engineers for transfer to other virtual factories. Transfers process to high volume manufacturing and provide support in new factory start-up as well as install and qualification of the new production lines. A successful candidate should also exhibit the following behavioral traits: Problem-solving, analytical, troubleshooting willingness and communication skills.

Qualifications:

Minimum Qualifications: Bachelor, Master, or PhD degree in a relevant science, engineering, and technology fields (Physics, Mechanical, Chemical, Electrical, Electronic and Materials Engineering related field). Preferred qualifications: Experience in process and equipment engineering in semiconductor Involvement in process development in assembly and packaging Has experience in die attach module Led product direct startup/NPI Knowledge in statistical design of experiments to characterize process and problem-solving techniques

          

Job Type:

College Grad

Shift:

Shift 1 (Malaysia)

Primary Location: 

Malaysia, Kulim

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.