Global Quality IC Package Design/Development Quality Assurance Principal Engineer

Micron Technology

7+ Years | Boise, Idaho, United States (On Site) | Full Time | 1 day ago

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Job Summary

Micron's Global Quality (GQ) organization ensures high standards for advanced memory solutions. As a GQ Package Design/Development Quality Assurance (Pkg DDQA) Principal Engineer, you will be responsible for the quality and reliability of new IC package technology introductions. This role focuses on advanced memory solutions, mitigating Chip-Package Interaction risks before New Product Introduction. You will act as a subject matter expert, lead root cause analysis, support customer engagements, and contribute to industry standards while mentoring and advancing technology through innovative solutions.

Must Have

Execute technical risk assessment and NUDD analysis
Lead risk mitigation execution
Develop holistic qualification plans
Coordinate qualification execution
Provide recommendations on releasing new package technologies
Serve as SME for problem-solving related to package technology
Ensure effective root cause analysis and corrective/preventive actions
Collaborate with customer-facing teams
Draft and present content addressing customer issues
Represent Micron’s interests in industry standards bodies (JEDEC, AEC)
Provide SME support and mentoring for package reliability engineering
Master’s degree or equivalent in Electrical/Electronics, Mechanical, Material Science and Engineering, Physics, or related field
7+ years in semiconductor package design, manufacturing, or Q&R
Experience with advanced packaging technologies (3DI, Wafer-2-Wafer, SiP)
Expert applied knowledge of package-level and board-level reliability test methods
Expert applied knowledge of reliability acceleration modeling and sampling statistics
Expert understanding of Chip-Package Interaction and stress effects on reliability
Thorough knowledge of semiconductor package designs, assembly processes, and board-level reliability challenges
Understanding of mechanical and material interaction effects on IC component and PCB assembly reliability
Knowledge of statistics and quality management tools (SPC, FMEA, 8D CAR)
Self-motivated, detail-oriented, able to work independently
Strong analytical and multi-tasking skills
Excellent written and verbal communication skills in English

Good to Have

Ability to mentor
Ability to publish technical papers (internal and external)
Experience collaborating with industry standards bodies
Experience driving beneficial changes in industry standards
Strong problem-solving skills
Ability to interact effectively with cross-functional teams

Perks & Benefits

Paid Time Off
Continuous Learning
Wellness Programs
Stock Purchase Program
Health Insurance
Recognition
Dental Insurance
Vision Insurance
Income Protection Programs
Paid Family Leave
Paid Holidays

Job Description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

About our Team:

Micron’s Global Quality (GQ) organization ensures the highest standards of quality and reliability for advanced memory solutions. Our team collaborates with Technology Development, Engineering, and customer-facing groups to mitigate risks, drive innovation, and uphold industry-leading standards through rigorous testing, analysis, and continuous improvement.

Position Overview:

As a GQ Package Design/Development Quality Assurance (Pkg DDQA) Principal Engineer at Micron Technology Inc., you will be responsible for the quality and reliability of new IC package technology introductions. This role focuses on advanced memory solutions, ensuring Chip-Package Interaction risks are understood and mitigated prior to New Product Introduction. You will act as a subject matter expert, lead root cause analysis, support customer engagements, and contribute to industry standards while mentoring and advancing technology through innovative solutions.

Responsibilities:

Execute technical risk assessment and NUDD (New, Unique, Different, Difficult) analysis for new designs/design rules and lead risk mitigation execution.
Develop holistic qualification plans and coordinate execution.
Provide recommendations on releasing new package technologies based on test results and technical risk assessments.
Serve as SME for problem-solving related to package technology, ensuring effective root cause analysis and corrective/preventive actions.
Collaborate with customer-facing teams to draft and present content addressing customer issues and requests.
Represent Micron’s interests in industry standards bodies such as JEDEC and AEC.
Provide SME support and mentoring to elevate package reliability engineering knowledge across the company.

Minimum Qualifications:

Master’s degree or equivalent experience in Electrical/Electronics, Mechanical, Material Science and Engineering, Physics, or related field.
7+ years of experience in semiconductor package design, manufacturing, or Quality & Reliability (Q&R).
Experience with advanced packaging technologies (e.g., 3DI, Wafer-2-Wafer, SiP).
Expert-level applied knowledge of package-level and board-level reliability test methods, reliability acceleration modeling, and sampling statistics.
Expert-level understanding of Chip-Package Interaction and effects of thermomechanical and hygroscopic swelling stresses on reliability.
Thorough knowledge of semiconductor package designs, assembly processes, and board-level reliability challenges.
Understanding of mechanical and material interaction effects on IC component and PCB assembly reliability.
Knowledge of statistics and quality management tools (SPC, FMEA, 8D CAR).
Self-motivated, detail-oriented, and able to work independently with strong analytical and multi-tasking skills.
Excellent written and verbal communication skills in English.

Preferred Qualifications:

Ability to mentor and publish technical papers (internal and external).
Experience collaborating with industry standards bodies and driving beneficial changes.
Strong problem-solving skills and ability to interact effectively with cross-functional teams.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.

We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.

Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.

Additionally, Micron benefits include a robust paid time-off program and paid holidays.

For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at

hrsupport_na@micron.com

or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

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