Job Description:

How would you like to work in an organization that provide diverse and inclusive workplace where everyone respects and builds trust with each other? Are you a passionate learner who’s always looking for opportunities to improve and innovate? If this is what you are looking for, Intel is the place to be!

At Intel, we are always learning new things and pushing the boundaries…and that drives amazing experiences! We want you to dream big and help us take on some of the biggest technical challenges in the industry.

Intel Vietnam is the largest factory in Intel’s global Assembly and Test network and a critical site for our IDM2.0 strategy. The clean room facility is located at Saigon High Tech Park in Thu Duc city. The site is proud of producing Intel’s latest technology chip products including 5G, IoT, Desktop, Mobile, etc.

We are looking welcome a Module Engineer into our team! A highly energetic individual with strong technical background to drive engineering solutions and enable new technology transfers.

Position 1: Module Engineer within Assembly Engineering Department.

The Assembly Engineering department (AE) is an important part of this vision, in charge of assembling our silicon into microprocessors. In the role of Assembly Engineering Module Engineer, your responsibilities will include:

• Empowered to lead critical resolution of operational needs for the Assembly process and equipment.
• Optimize advance process control systems to detect signals & automate containment.
• Define maintenance procedures, engage & partner with technicians and manufacturing teams to maintain equipment meeting highest standards.
• Discover & enable new breakthroughs process and equipment improvements.
• Engage & lead new technology/product transfers and integration.
• Actively engaged in our Virtual Factory (VF) network, driving cross site learnings and problem resolution.

Position 2: Module Engineer within Test Engineering Department

• Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits.
• Conducts tests and measurements of their operations to ensure control over critical dimensions and defectivity of the process line. Recommends and implements modifications for operating the equipment in order to improve production efficiencies, manufacturing techniques and optimizing production output for existing products, to meet safety, quality and cost indicator goals.
• Grows Insite manufacturing capacity to high volumes to demonstrate the technology capability while simultaneously transferring the technology to counterparts in manufacturing sites across the globe.
• Owns execution of maintenance and repair activities for equipment and relevant module of components. Initiates and owns the continuous improvement of equipment and process for key performance indicators (e.g., safety, quality, cost, productivity, defects, and yield) and works with equipment suppliers as required.
• Owns process development line items aligned to high volume process nodes.
• Participates in the transfer of technology to other sites through training and audit of installation and qualification outcomes to ensure matched processing across sites.
• Owns development and optimization of excursion prevention systems for the equipment and process.
• Owns detection of discrepant material or activities of the equipment and process.
• During factory ramps, owns equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria (from design through Safety Level 1 and Safety Level Supplier milestones, Intel qual and manufacturing readiness processes.

Qualifications:

• Possess a Bachelor or a Master of Science degree in Electronics, Electrical, Mechanical, Mechatronics, Automation & Control, Computer Engineering and/or other related majors.
• Have a minimum of 2 years of relevant experience for the experienced position.
• Fresh graduates are invited to apply for the Module Engineer entry-level position.
• Strong English verbal and written communication skills.
• Self-motivated, team-oriented individual with a strong data driven mindset and positive learning attitude.
• Demonstrate discipline, attentiveness to detail and self-independence.
• Capable to timely manage multiple assignments and meet the deliverable timeline.
• Familiarity with semiconductor packaging and technologies would be an added advantage.