Optoelectronics Design Engineer

The Optical Systems Division is the world leader in high-speed fiber optic solutions for advanced cloud and AI networks. With a rich heritage of fiber optic technology and operations tracing back to Avago Technologies and Hewlett-Packard, Broadcom continues to deliver innovative and differentiated products with large-scale manufacturing capabilities for a wide range of markets and applications, spanning datacom and telecom to industrial and automotive.

As optical interconnect volume and market size continue to grow because of AI clusters, we are on a mission to deliver the highest speed, lowest power, and most integrated optical devices to our customers. Together, our work is ensuring that interconnect is not the limit of AI cluster size.

Summary of Tasks to be Performed:

Candidate will be responsible for:

• Design and characterization of state-of-the-art high power, narrow linewidth, wavelength tunable and high speed InP optoelectronic devices.
• Organization and execution of product development projects from concept to manufacturing.
• Leadership of multi-disciplinary wafer fabrication, testing, assembly and operations teams to define and execute projects.
• Qualification of optoelectronic devices per Telcordia standards.
• Documentation of product designs and manufacturing processes.
• Analysis of product performance and implementation of yield improvement plans.

Competencies Required:

Candidate must have:

• A Ph.D. in Electrical Engineering, Physics or related field.
• At least 7 years’ direct experience in the design and characterization of high power and high speed III-V edge-emitting semiconductor devices.
• Extensive theoretical and experimental knowledge of III-V semiconductor material properties, epitaxial growth and wafer fabrication processes.
• Direct experience with DC, RF and digital transmission testing of high-speed optoelectronic devices and systems.
• Demonstrated leadership ability to organize and execute product development projects involving multiple teams across a variety of disciplines.

Skills preferred:

• Direct experience in process development and wafer fabrication of III-V semiconductor devices, including photolithography, thin-film deposition, wet and dry etching techniques.
• Experience using commercial photonic and RF design software packages.
• Experience applying statistical analysis techniques and process control in a manufacturing environment.