Principal Package Design Engineer

About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

The Marvell Advanced Packaging R&D team is responsible for package design and technology development to meet the electrical, mechanical, thermal and system requirements for the next generation high performance computing (HPC), Artificial Intelligence (AI) and networking solutions. The group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, processability, manufacturability, and reliability, involving high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Many of the new designs require multi-chip, multiple component configurations involving, but not limited to, 2.5D and 3D packages, Co-packaged copper or optics and advanced substrates. Marvell has partnered with the world's leading manufacturers to solve our customer’s most challenging designs and integrations with industry-leading packaging technologies.

What You Can Expect

• Perform design feasibility studies for new PCB substrates and board technologies to enhance performance while meeting manufacturing and reliability requirements. Optimize for power, performance, area, thermal and mechanical.
• Develop symbols and libraries, improve workflows and methodology; automate design and design verification.
• Collaborate with IP, Si design, SI/PI, thermal/mechanical, production and test teams to cover all bases.
• Work with stakeholders to define and validate advanced design rule roadmap for interposer, substrates and packages.
• Work with vendors on substrates and board manufacturing. Create proof-of-concept samples.
• Create package solutions for datacenter silicon package, innovate routing and layout, drive material and process advancements, and validate solutions at component and system levels.
• Create package outline drawings, bonding diagrams, 3D rendering of package drawing.

What We're Looking For

• Extensive experience in PCB substrates and board design for advanced package technologies with deep understanding of design for manufacturing and reliability.
• Bachelor’s degree in electrical engineering, mechanical engineering or related fields and 15+ years of related professional experience or master’s degree and 12+ years of related professional experience or PhD degree with 8+ years of experience.

Skills needed to be successful in this role:

• Deep and innovative thinking, fundamental understanding of design rules, breakout, place and route, signal shielding, reference plane, power distribution, pinout considering overall package and system requirements.
• Mastery in tools and workflows: APD and SiP, AutoCAD, SolidWorks, Virtuoso
• Mastery in design layout for DDR, SerDes, D2D, D2H, ADC, DAC, PCIE, Ethernet, etc
• Good understand of signal and power integrity at substrates, board, package, and system level.
• Understanding of advanced 2.5D/3D package technology including (a) CoWoS-S/R/L, (b) EMIB, (c) CPO, (d) CPC
• Understanding of chip-package interaction and failure mechanism at component and board level, thermal interface materials and thermal solutions.
• Ability to manage programs involving cross-functional teams. Strong interpersonal skills and willingness to learn new things are necessary along with the ability to work with stakeholders in multiple time zones across the globe.
• Ability to influence suppliers to align their roadmap with company goals.
• Strong communication, presentation and documentation skills

The ideal candidate would have:

• Understanding of substrate and Board manufacturing process and reliability.
• Understanding of optical routing on substrates.
• Scripting skills in Python.
• Fundamental understanding of material properties, package fail mechanism.

Expected Base Pay Range (USD)

148,500 - 219,780, $ per annum

The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

At Marvell, we offer a total compensation package with a base, bonus and equity.Health and financial wellbeing are part of the package. That means flexible time off, 401k, plus a year-end shutdown, floating holidays, paid time off to volunteer. Have a question about our benefits packages - health or financial? Ask your recruiter during the interview process.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.

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