Process Support Engineer III - (E3) - AP PVD
Applied materials
Job Summary
As a Process Support Engineer (PSE) at Applied Materials, you will guide products through their lifecycle, from initial concept to final qualification. This role involves high-visibility customer support, on-site installations, system diagnoses, and repair of complex systems. You will collaborate with customers and R&D to develop leading-edge processes for advanced semiconductor chips, create and analyze experiments, troubleshoot complex problems, and perform root cause analyses, with a strong focus on Physical Vapor Deposition (PVD) for wafer-level packaging.
Must Have
- Provide high-visibility customer support through on-site installations, system diagnoses, and service/repair of complex systems
- Work closely with customers and R&D teams to develop leading-edge processes for advanced semiconductor chips
- Create hypothesis experiments and design of experiments (DOE)
- Analyze data with statistics and compile reports with high-level conclusions
- Troubleshoot complex problems and perform root cause analyses
- Master’s degree in chemistry/physics, materials engineering, electrical engineering, optoelectronics or related field
- 4–7 years of experience in the semiconductor fab or equipment industry
- Hands-on PVD experience in packaging or wafer-level metallization
- Strong interpersonal and communication skills
- Communication proficiency in English language
Perks & Benefits
- Supportive work culture that encourages learning, development, and career growth
- Programs and support for health and wellbeing
- Employee Assistance Program
- Meditation and family support resources
- Travel insurance
- Competitive and comprehensive total rewards program
- Free career development and mentoring programs
- Technical and professional courses
- Worldwide "Giving" program (employee contributions matched by Applied Materials Foundation)
Job Description
Job description
Job ID
R2520240
Who We Are
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.
What We Offer
You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.
At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.
As a Process Support Engineer (PSE), you'll play a critical role in guiding products through their entire lifecycle, from initial concept to final qualification. You will provide high-visibility customer support through on-site installations, system diagnoses, and the service and repair of complex systems and equipment. PSEs work closely with customers and R&D teams to develop leading-edge processes used to manufacture advanced semiconductor chips, and create hypothesis experiments and design of experiments (DOEs). You'll analyze data with statistics and compile reports with high-level conclusions on technically challenging process engineering experiments. Additionally, you will troubleshoot complex problems, perform root cause analyses, and resolve difficult process engineering and customer product issues. Process Support Engineers work across technologies such as: Chemical Vapor Deposition, Atomic Layer Deposition, Plasma Reactive Ion Etch, Physical Vapor Deposition, Anneal and Implant.
Position Summary
Applied Materials is seeking a Process Support Engineer (PSE) to join our Advanced Packaging team in Hsinchu. In this role, you will provide hands-on support for semiconductor advanced packaging process technologies, with a strong focus on Physical Vapor Deposition (PVD) for wafer-level packaging and related metallization processes. You will collaborate with cross-functional teams and customers to develop and optimize cutting-edge packaging solutions for next-generation semiconductor devices.
Role Responsibilities:
- Provide high-visibility customer support through on-site installations, system diagnoses, and the service and repair of complex systems and equipment
- Work closely with the customer to develop leading-edge processes used to manufacture the most advanced semiconductor chips, many of which are inside everyday electronic devices
- Create hypothesis experiments and design of experiments (DOE); analyze data with statistics; and compile reports with high-level conclusions on technically challenging process engineering experiments
- Troubleshoot complex problems; perform multiple root cause analysis; and resolve a variety of difficult process engineering and customer product issues
- Communicate with both internal stakeholders and the customer to achieve goals with a focus on building relationships and establishing trust
- Apply your growing knowledge of best practices to offer a new perspective using existing solutions
- Serve as a resource for junior colleagues and a liaison between the customer and business unit; you may also lead small projects with manageable risks and resource requirements
Minimum Qualifications:
- Master’s degree in chemistry/ physics, materials engineering, electrical engineering, optoelectronics or related field
- 4–7 years of experience in the semiconductor fab or equipment industry, with hands-on PVD experience in packaging or wafer-level metallization
- Strong interpersonal and communication skills to explain sensitive information and work to build consensus among project stakeholders
- Communication proficiency in English language
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Additional Information
Time Type: Full time
Employee Type: Assignee / Regular
Travel:
Relocation Eligible: No