Sr Technology Integration and Customer Enabling Lead

41 Minutes ago • 4 Years + • $136,990 PA - $264,470 PA
Software Development & Engineering

Job Description

The Sr. Technology Integration and Customer Enabling Lead will be responsible for developing integrated process flow, scaling up, and ensuring transfer readiness for next-generation EMIB substrate and packaging technologies. This role involves representing Intel Foundry's process readiness in customer meetings, collaborating with internal partners on development strategy and execution, and working with design and assembly teams to define integrated design rules and specifications for optimal yields.
Good To Have:
  • Previous related work experience in a semiconductor foundry.
  • Experience in Technical Program Management.
  • Experience in Technical Problem Solving.
Must Have:
  • Develop integrated process flow, scale up, and transfer readiness for next-generation EMIB substrate and packaging technologies.
  • Represent Intel Foundry's process readiness in customer-facing meetings.
  • Collaborate with Substrate Definition, Execution, and Supplier Engineering on development strategy and execution.
  • Work with design and downstream assembly/yield integration teams to develop integrated design rules and specifications.
  • PhD in Electrical/Computer Engineering, Computer Science, Math, Physics, Material Science or STEM with 4+ years experience OR Masters with 6+ years experience.
  • Experience in substrate, silicon or assembly process development.
  • Working experience on processes like patterning/lithography, wet processes, electroless/electrolytic plating, CMP, sputtering/PVD/CVD bumping.
Perks:
  • Competitive pay
  • Stock options
  • Bonuses
  • Health benefits
  • Retirement programs
  • Vacation

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Job Description:

The Substrate Technology Integration team is seeking a qualified candidate to fill a Sr. Technology Integration position for next generation EMIB substrate and packaging technology development.

  • In this role, the candidate will be responsible for the development of integrated process flow, scale up and transfer readiness of critical building blocks needed for next generation packaging technologies.
  • The candidate will represent Intel Foundry's process readiness in Customer facing meetings.
  • The candidate will collaborate closely with partners in Substrate Definition, Execution and Supplier Engineering in mapping the development strategy, managing the starts and execution of plans in the factory to meet program milestones.
  • Likewise, the candidate will work with partners in design and downstream assembly and yield integration teams in developing integrated design rules and specifications for balanced assembly and substrate yields.

Behavioral traits/Skills that we are looking for:

  • The candidate is expected to have strong problem-solving skills, high tolerance to ambiguity, ability to collaborate well in a fast-paced environment and excellent communication skills.
  • Demonstrated experience in structured problem solving, high tolerance to ambiguity and achieving strong results in a fast-paced environment
  • Demonstrated ability to work with large diverse teams with strong collaboration, influencing skills and excellent communication skills to peers and senior management

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

  • PhD in Electrical or Computer Engineering, Computer Science, Math, Physics, Material Science or STEM related field with 4+ years of related work experience
  • OR Masters in Electrical or Computer Engineering, Computer Science, Math, Physics, Material Science or STEM related field with 6+ years of related work experience

Specific areas of expertise and experience should include the following:

  • Experience in substrate, silicon or assembly process development and working experience on typical processes such as patterning/lithography, wet processes, electroless and electrolytic plating, CMP, sputtering/PVD/CVD bumping etc.

Preferred Qualifications:

  • Previous related work experience in a semiconductor foundry preferred
  • Experience in Technical Program Management and Technical Problem Solving

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003

Annual Salary Range for jobs which could be performed in the US:

$136,990.00-264,470.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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