Job Details:

Job Description: 

Come and join the Foundry Services (FS) Packaging and Test Business Group as a Test Strategic Business Development Manager. As an integral part of Intel's new IDM 2.0 Strategy, we are establishing Foundry Services (FS), a fully vertical, stand-alone foundry business, reporting directly to the CEO. Foundry Services (FS) will be a world-class foundry business and major provider of US- and European-based capacity to serve customers globally. FS will be differentiated from other foundries with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe, and a world-class IP portfolio that customers can choose from, including x86 cores, graphics, media, display, AI, interconnect, fabric and other critical foundational IP, along with Arm and RISC-V ecosystem IPs. FS will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions, using industry standard design packages.

This business unit is completely dedicated to the success of its customers with full P and L (Profit and Loss) responsibilities. This role will ensure that our foundry customers' products receive our utmost focus in terms of service, technology enablement, and capacity commitments. IFS is already engaged with customers today starting with our existing foundry offerings. We are expanding at a torrid pace to include our most advanced technologies, which are ideal for high-performance applications. Packaging and Test are critical revenue enablers for FS and a key part of Intel's forward-looking strategy. IFS Packaging and Test Business Group has been created to develop, grow, and execute a robust packaging and test roadmap.

The Test Business Development Manager’s responsibilities will include (but are not limited to):

• Financial modeling and analysis: Analyze competitive intelligence, trends, and financial data to make business conclusions for portfolio offerings for potential FS customers and perform ROI analysis.
• Pricing strategy development: Develop and recommend pricing strategies for internal and external test customers.
• Customer deal management: Drive and coordinate deals, tradeoffs, and FS business processes, working across internal Intel groups (technology development, manufacturing, supply chain, sales and marketing, etc.).
• Create technical marketing materials to inform customers on our offerings and educate customers on FS value proposition, relative to competitors.
• Customer Relationship Management: Lead customer-facing meetings and manage the test engineering relationship from concept to production.
• Risk and Pricing Assessments: Work with engineering and supply chain teams to assess RFQ risks and set pricing.
• Feedback and Competitive Analysis: Gather customer feedback and analyze trends to enhance the FS packaging and test roadmap.
• Executive Communication: Communicate FS test strategy and roadmap plans to internal and external executives.
• Technology Representation: Represent customer interest in internal technology groups during new technology development.

Aside from the qualifications provided below, the ideal candidate shall possess the following behavioral skills:

• Strong Analytical Skills: Capability to analyze complex data and technical specifications to make informed decisions that enhance packaging design and performance.
• Effective Communication Skills: Proficiency in conveying technical information clearly and concisely to diverse audiences, including internal teams, senior management, and external clients, ensuring alignment and understanding.
• Demonstrated Ability to Plan and Manage Projects: Experience in organizing and overseeing packaging projects from conception to completion, ensuring they are delivered on time, within scope, and on budget.
• Ability to Work Independently in a Highly Matrixed Structure: Self-motivation and initiative to navigate and operate effectively within a complex organizational structure, collaborating with various departments and stakeholders.
• Presentation Skills in Senior Management (VP and Corporate VP Level): Competence in preparing and delivering presentations that communicate project status, challenges, and strategic recommendations to senior leadership, influencing decision-making.
• Presentation Skills for Engaging with External Customers and Suppliers: Skill in engaging with external partners to present packaging solutions, gather feedback, and build strong relationships that support business objectives and customer satisfaction.

Qualifications:

The Minimum qualifications are required to be initially considered for this position.  (Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research.) The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

This position is not eligible for Intel immigration sponsorship.

Minimum Qualifications:

• Batchelor Degree in a STEM related field of study or Business, Finance, Marketing, Program/Project Management.
• 7+ years of experience in semiconductor test.
• 3+ years of experience in one or more of the following: OSAT-Semiconductor customer interface, test market or test competitive analysis, or test pricing analysis.
• 3+ years of experience in customer engagement.

Preferred Qualifications:

• Experience in industry package and test development and manufacturing capabilities, including sort/probe, assembly/wafer level assembly, and package/final test technology.
• Experience with Intel and competitor packaging and test roadmaps.
• Experience with product architecture or design, IP development cycles, and impact on test requirements.
• Experience of both business and technical background.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Arizona, Phoenix

Additional Locations:

US, California, Folsom, US, California, Santa Clara, US, Oregon, Hillsboro

Business group:

Intel Foundry is dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. As stewards of Moore's Law, we innovate and foster collaboration within an extensive partner ecosystem to advance technologies and enable our customers to design leadership products. Our strategic investments in geographically diverse manufacturing capacities bolster the resilience of the semiconductor supply chain. Leveraging our technological prowess, expansive manufacturing scale, and a more sustainable supply chain, Intel Foundry empowers the world to deliver essential computing, server, mobile, networking, and automotive systems for the AI era. This position is part of the Foundry Services business unit within Intel Foundry, a customer-oriented service organization that is dedicated to the success of its customers with full P&L responsibilities. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.  Find more information about all of our Amazing Benefits here:

https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003

Annual Salary Range for jobs which could be performed in the US:

$179,880.00-$253,940.00

Salary range dependent on a number of factors including location and experience.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.