IC Packaging Principal Product Engineer

undefined ago • 5 Years + • Product Management • $136,500 PA - $253,500 PA

Job Summary

Job Description

Cadence Design Systems is seeking a Principal Product Engineer for its System Design and Analysis group, focusing on Advanced IC Package Routing, Technologies, and Flows. This on-site role in San Jose, CA, involves driving innovation, expanding leadership in advanced routing solutions, and tackling complex substrate interconnect challenges. The engineer will bridge customer needs with R&D, creating specifications, documentation, and presentations, collaborating across teams to ensure successful customer adoption.
Must have:
  • Driving innovation and expanding Cadence IC Packaging Advanced Routing and Automated Solutions leadership.
  • Tackling the complex substrate interconnect challenges of advanced package designs.
  • Bridging the gap between customers and R&D, ensuring existing tools meet customer needs.
  • Innovating new industry-leading solutions.
  • Creating detailed specifications, collaborating with R&D for implementation.
  • Creating product documentations, and delivering customer presentations.
  • Working with different teams and customers to collaborate, understand needs.
  • Creating guidance for implementation, and support successful customer adoption/proliferation.
  • Direct collaboration with Research and Development, Product Marketing, Technical Field Operations, and key customers.
  • BS/MS degree in Electrical/Electronics/Computer Engineering with at least 5 years of IC Packaging experience.
  • Strong problem-solving skills.
  • Excellent verbal & written communication, presentation, and documentation skills.
  • Strong work ethic, proactive leadership and execution, and effective teamwork are essential.
  • Efficiently work across functions and geographies, with ability to develop good working relationships.
Good to have:
  • Routing experience of large and complex multi-layer substrate packages with high pin counts, high speed signals, and dense routing requirements is preferred.
  • Industry knowledge of advanced IC Packaging technologies and design flows.
  • Software development knowledge is a plus.
Perks:
  • paid vacation
  • paid holidays
  • 401(k) plan with employer match
  • employee stock purchase plan
  • a variety of medical, dental and vision plan options

Job Details

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

Cadence Design Systems is looking for a candidate to be part of its Product Engineering Team in the System Design and Analysis group, with focus on Advanced IC Package Routing, Technologies, and Flows.

Location; San Jose, CA, on-site.

As an IC Packaging Product Engineer, you will be responsible for driving innovation and expanding Cadence IC Packaging Advanced Routing and Automated Solutions leadership, tackling the complex substrate interconnect challenges of advanced package designs. The Product Engineer bridges the gap between customers and R&D, ensuring existing tools meet customer needs while innovating new industry-leading solutions. You will be responsible for creating detailed specifications, collaborating with R&D for implementation, creating product documentations, and delivering customer presentations. The Product Engineer must work with different teams and customers to collaborate, understand needs, create guidance for implementation, and support successful customer adoption/proliferation. The role requires direct collaboration with Research and Development, Product Marketing, Technical Field Operations, and key customers.

We are looking for an individual with a passion for innovation, self-driven, detail-oriented, and a strong background in IC Packaging.

The Position Requirements are:

  • BS/MS degree in Electrical/Electronics/Computer Engineering with at least 5 years of IC Packaging experience.
  • Proficient in Allegro X Advanced Package Designer (APD).
  • Routing experience of large and complex multi-layer substrate packages with high pin counts, high speed signals, and dense routing requirements is preferred.
  • Industry knowledge of advanced IC Packaging technologies and design flows.
  • Software development knowledge is a plus.
  • Strong problem-solving skills.
  • Excellent verbal & written communication, presentation, and documentation skills.
  • Strong work ethic, proactive leadership and execution, and effective teamwork are essential.
  • Efficiently work across functions and geographies, with ability to develop good working relationships.

The annual salary range for California is $136,500 to $253,500. You may also be eligible to receive incentive compensation: bonus, equity, and benefits. Sales positions generally offer a competitive On Target Earnings (OTE) incentive compensation structure. Please note that the salary range is a guideline and compensation may vary based on factors such as qualifications, skill level, competencies and work location. Our benefits programs include: paid vacation and paid holidays, 401(k) plan with employer match, employee stock purchase plan, a variety of medical, dental and vision plan options, and more.

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About The Company

Cadence plays a critical role in creating the technologies that modern life depends on. We are a global electronic design automation company, providing software, hardware, and intellectual property to design advanced semiconductor chips that enable our customers create revolutionary products and experiences. Thanks to the outstanding caliber of the Cadence team and the empowering culture that we have cultivated for over 25 years, Cadence continues to be recognized by Fortune Magazine as one of the 100 Best Companies to Work For. Our shared passion for solving the world’s toughest technical challenges, our dedication to pushing the limits of the industry, and our drive to do meaningful work differentiates the people of Cadence.

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