Process Integration Engineer
Job Description
- Direct working experience in wafer fab process integration.
- Perform comprehensive wafer scrap analysis.
- Identify root causes for low yield and drive Operations for improvements.
- Lead quality investigations and continuous improvement programs.
- Resolve chronic process and quality issues.
- Identify potential frontend fab process steps/areas for baseline yield improvement.
- Conduct Design of Experiment (DOE) to optimize process conditions and define process windows.
- Guide process technicians in problem solving and analysis.
- Provide process, failure, and yield analyses and product trainings.
- Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.
- Experience in high volume manufacturing of electronics components in an MNC or semi-conductor industry.
- Good knowledge of statistical and quality tools.
- Experience with software applications such as MS Power Point, Excel and Word.
- World-class health benefit options providing comprehensive coverage.
- Programs designed to help employees build and prepare for a financially secure future.
- Self and family resources to build emotional/mental strength and resilience.
- Wellbeing programs and resources to support employees to Live+Well and Work+Well.
Job Posting Date
2025-09-26
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Company:
RF360 Singapore Pte., Ltd.
Job Area:
Engineering Group, Engineering Group > Hardware Engineering
General Summary:
As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.
Minimum Qualifications:
• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.
Job Responsibilities
· Perform comprehensive wafer scrap analysis, identify root causes for low yield and drive Operations for improvements.
· Feedback and work closely with process modules on process-related low yield issues to come up with effective containment and corrective actions to prevent reoccurrence.
· Lead quality investigations and continuous improvement programs to resolve chronic process and quality issues, and institute permanent resolutions to assure product quality and enhance process robustness.
· Identify potential frontend fab process steps/areas as opportunities for baseline yield improvement and work closely with process/equipment engineers via various yield improvement projects.
· Identify areas for yield improvement between Product and Process.
· Conduct Design of Experiment (DOE) to optimize process conditions and to define process windows.
· Apply hands-on and with deep involvement at work.
· Guide process technicians in problem solving and analysis.
· Take accountability of work and possess strong sense of responsibility.
· Provide process, failure and yield analyses and product trainings to all technicians to build up their technical
Education/Experience Requirements
· At least a Bachelor’s degree in Electronic or Electrical Engineering or equivalent.
· Experience in high volume manufacturing of electronics components in an MNC or semi-conductor industry.
· Direct working experience in wafer fab process integration will be an added advantage.
· Possess strong technical competencies in his field of study.
· Able to work under pressure and with strong commitment at work.
· Good knowledge of statistical and quality tools.
· Experience with software applications such as MS Power Point, Excel and Word.
