Semiconductor Wafer Fab Process Engineer

2 Months ago • 1-5 Years • Manufacturing • $102,000 PA - $150,000 PA

Job Summary

Job Description

This Semiconductor Wafer Fab Process Engineer role involves monitoring and supporting daily wafer fabrication processes (lithography, thin film, etch, clean, thermal, metrology/characterization, and backside processes). You will ensure process reliability, provide technical support, optimize processes for yield/defectivity/cycle time reduction, and enhance process control plans using SPC. Problem resolution will involve data analytics, failure analysis (FA), DOE, and mistake-proofing. The role contributes to developing custom silicon solutions for Google's direct-to-consumer products, shaping next-generation hardware experiences. Experience in root cause analysis and data analysis is essential.
Must have:
  • Bachelor's degree in relevant field
  • 1+ years semiconductor wafer fabrication experience
  • Root cause analysis & data analysis skills
  • Process optimization & improvement
  • Problem-solving & failure analysis
Good to have:
  • Master's or PhD in relevant field
  • 5+ years experience in multiple process areas
  • Yield improvement & defectivity reduction experience
  • Equipment qualification & implementation experience
  • Excellent communication & documentation skills
Perks:
  • Bonus
  • Equity
  • Benefits

Job Details

Minimum qualifications:

  • Bachelor's degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, a related field, or equivalent practical experience.
  • 1 year of experience in semiconductor wafer fabrication.
  • Experience with root cause analysis, failure analysis, and data analysis techniques.
  • Ability to work non-standard hours, such as a compressed schedule of four 10 hour shifts a week, including weekends.

Preferred qualifications:

  • Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).
  • 5 years of experience in semiconductor wafer fabrication, with expertise in multiple process areas.
  • Experience with yield improvement, defectivity reduction, and cycle time reduction initiatives.
  • Experience with equipment qualification and implementation.
  • Communication and documentation skills.

About the job

Be part of a diverse team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.

Google's Raxium display group has established a revolutionary semiconductor materials display technology that enables new functionality in display products, bringing to users a closer and more natural linkage between the digital and physical realms in applications such as augmented reality (AR) and light-field display. With start-up roots and a state-of-the-art compound semiconductor fab in Silicon Valley, Raxium is seeking to build upon its engineering team with an aim to disrupt next-generation display markets.

The US base salary range for this full-time position is $102,000-$150,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target salaries for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about .

Responsibilities

  • Monitor, sustain, and support daily wafer fabrication processes encompassing areas of lithography, thin film, etch, clean, thermal, metrology/characterization and backside end of line processses.
  • Ensure process reliability and consistency by providing technical support to operators, technicians, and other engineers.
  • Review, propose, optimize, improve and implement various wafer fabrication processes for yield improvement, defectivity reduction, cycle time reduction, and general best practises of wafer handling.
  • Enhance area process control plan and the process capability through implementation of best known manufacturing methods and statistical process control (SPC).
  • Drive problem resolution process associated with the quality excursion in the fab area encompassing data analytics, methodical problem solving, failure analysis (FA), design of experiments (DOE), and mistake-proof.

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