This position is for a packaging front-end R&D engineer focusing on IC (integrated circuit) packaging technology research and development. The role involves working with a global team on development projects and other tasks, including new packaging technology development, new package-related process development, advanced material interface study, advanced IC package failure analysis, and coordinating development projects independently. The candidate will also be responsible for communication and cooperation among global teams across the US, Europe, Malaysia, Japan, and France.
Must Have:- Pursuing Master's or PhD degree
- Major in Metallic Materials Engineering, Polymer Materials Engineering, Mechanical Engineering and Automation
- CET-4 or equivalent English level
- Capability to work in cross-functional/global teams
- Independent R&D capability