Job Details:

Job Description: 

Responsibilities and scopes may be quite diverse depending on the function or project assigned. The industrial exposure and technical skill learned will enhance the students knowledge and experience for their future career undertaking.

Qualifications:

This internship is only open for the undergraduate student who has taken the Advanced Packaging Flagship Curriculum and required to undergo the internship program by USM academic plan.

          

Job Type:

Student / Intern

Shift:

Shift 1 (Malaysia)

Primary Location: 

Malaysia, Kulim

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.