ADVANCED PACKAGING TD - SR ENGINEER PACKAGE INTEGRATION

As a process integration engineer in Micron’s Advanced Packaging Technology Development (APTD) group, you will be responsible for process development and integration schemes for memory devices, specifically HBM products. This involves working with cross-functional teams on unit processes, real-time yield and defect analysis, and inline WIP control to meet product specifications and device requirements. The role requires independent work on various APTD projects.

Must Have

• Yield and quality improvement for HBM products to support product milestone deliverables.
• Develop and lead integration processes from the conceptual phase to high-volume production for highly complex package development challenges.
• Work closely with multiple cross functional teams including defect team, probe testing team, and process module team.
• Able to work independently along with various projects inside of APTD team.
• Comprehensive understanding on HBM package structure and process flow.
• Familiar with integrated failure mode.
• Familiar with process change business process.
• Familiar with project managing to meet goal in time.
• Familiar with model based problem solving skill.
• Familiar with DOE establishment and analysis.
• Proficiency in JMP, XMoba, Yield cube3, Klayout, SPC software.

Perks & Benefits

• Paid Time Off
• Continuous Learning
• Wellness Programs
• Stock Purchase Program
• Health Insurance
• Recognition

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a process integration engineer in Micron’s Advanced Packaging Technology Development (APTD) group at Taiwan Taichung, you will be responsible for process development with integration scheme for memory devices application.

In this position, you will work with process module team, data science team, defect team to develop unit processes that meet product spec and device requirements for HBM products.

Additionally, real time yield and defect analysis, inline WIP control and escalate for any potential issues are needed.

RESPONSIBILITIES:

• Yield and quality improvement for HBM products to support product milestone deliverables.
• Develop and lead integration processes from the conceptual phase to high-volume production for highly complex package development challenges.
• Work closely with multiple cross functional teams including defect team, probe testing team, and process module team.
• Able to work independently along with various projects inside of APTD team.

Skillset and knowledge requirement as below:

1. Comprehensive understanding on HBM package structure and process flow.

2. Familiar with integrated failure mode

3. Familiar with process change business process.

4. Familiar with project managing to meet goal in time.

5. Familiar with model based problem solving skill.

6. Familiar with DOE establishment and analysis.

Software skill requirement as below

1. JMP

2. XMoba

3. Yield cube3

4. Klayout

5. SPC