DTCO Circuits Analysis Engineer

24 Minutes ago • 8 Years +

System Design

Job Description

This role involves driving design, simulation, development, and implementation for scientific research projects, leveraging device physics, electromagnetics, thermomechanical analysis, materials, chemistry, and process innovations. The engineer will investigate the feasibility of scientific principles for future products, develop prototypes, and perform etest assessments of novel devices, packages, and interconnects. They will also establish etest methodologies, provide process solutions across production modules, and quantify tradeoffs between various device, circuit, and system parameters to generate innovative solutions for Intel's roadmap.

Good To Have:

Virtuoso Environment experience.

Must Have:

Drive design, simulation, development, and implementation for scientific research projects.
Leverage device physics, electromagnetics, thermomechanical analysis, materials, chemistry, and process innovations.
Investigate feasibility of scientific principles for potential inventions and products.
Develop prototypes to demonstrate proof of concepts.
Design, fabricate, and perform etest assessment of novel devices, packages, and interconnects.
Establish etest methodologies, metrics, and criteria.
Provide process solutions across different production modules including lithography, etch, diffusion, CVD, PVD, CMP.
Own critical process and equipment research for device miniaturization and mass production.
Quantify tradeoffs between device, circuit, and system parameters.
Develop innovative solutions for Intel's future assembly packaging platform technologies.
Plan, setup, and execute experiments in collaboration with various labs and TCAD.
Develop and validate models for device physics, packaging, and systems.
Lead and manage vendor engagements.
8+ years of experience in Foundry or EDA.
Ph.D. or Master's degree.
Hands-On experience in DTCO, Advanced node layouts including automation and/or circuit benchmarking.

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Job Description:

This role requires regular onsite presence to fulfill essential job responsibilities. Drives design, simulation, development, and implementation activities for scientific research projects leveraging device physics and electromagnetics theory, thermomechanical analysis and simulations, materials, chemistry, and process innovations to drive research on novel devices, packages, interconnects, circuits, and systems.
Investigates the feasibility of applying scientific principles and concepts to potential inventions and products years before landing on a product roadmap. Develops prototypes to demonstrate proof of concepts. Designs, fabricates, and performs etest assessment of novel devices, packages, and interconnects including DC testing, RF small signal and large signal characterization techniques, pulsing, and stressing.
Establishes etest methodologies, metrics, and criteria of a device based on required application specifications.
Provides process solutions across different production modules including lithography, etch, diffusion, CVD, PVD, CMP, and overall systems requirements, including thermomechanical, power delivery and highspeed signaling, and cost.
Owns critical process and equipment research that enable rapid device miniaturization and the mass production of integrated circuits.
Quantifies the tradeoffs between various device, circuit, and system parameters, generating and exploring novel solutions to meet and solve the demands for continued performance improvements in devices, packaging, and systems.
Develops innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
Uses hands-on approach to plan, setup, and execute experiments in collaboration with device, module, reliability, analytical labs, and TCAD across fabrication sites and quantifies and benchmarks experimental results with best known methods and literature/academia.
Develops and validates models and the necessary measurements to advance the understanding of device physics, packaging, and systems.
Leads and manages vendor engagements to support various research and development activities across devices, packages, and interconnects.
Mentors external research in academia and industry consortia to help fill Intel's internal research pipeline.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

8+ years of experience in Foundry or EDA including Ph.D. or Master's degree
Hands-On experience in DTCO, Advanced node layouts including automation and/or circuit benchmarking experience.