Engineer, Advanced Packaging Integration Engineering

Micron is seeking an Advanced Packaging Integration Engineer to join their APTD team. This role involves developing and deploying advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability, and schedule requirements. The engineer will focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity by integrating semiconductors and collaborating with various engineering teams. Responsibilities also include identifying and diagnosing yield-related breakthroughs and ensuring a smooth transition from new product development to high-volume manufacturing.

Must Have

• Develop and enable advanced package technology for post-fab wafer finish and assembly processes
• Improve product quality, drive yield improvements, reduce costs, and enhance productivity
• Integrate semiconductors while partnering with process and product engineering teams
• Achieve and improve yields through silicon package integration innovation
• Collect and analyze data for actionable outcomes and decisions
• Ensure defense coverage through process, measurement, inspection, and testing
• Establish correlations between defense mechanisms to identify improvement opportunities
• Work closely with internal and external partners on technology development strategies
• Ensure smooth transition from new product development to high volume production
• Provide Process Of Record (POR) and Model Of Record (MOR) documentation
• B.S/M.S./Ph.D. (or equivalent education) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material, or other related technical fields
• Strong understanding of process flows, process interactions, and ability to integrate semiconductors while partnering with process and product engineering team
• Ability to resolve complex issues through root-cause or model-based problem solving
• Consistent track record to solve problems and address root causes

Good to Have

• Experiences in semiconductor process integration
• Good communication skills
• Keen interest in the semiconductor industry
• Leadership potential

Perks & Benefits

• Paid Time Off
• Continuous Learning
• Wellness Programs
• Stock Purchase Program
• Health Insurance
• Recognition

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.

We are currently experiencing a transformative period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.

We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team!

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.

Key responsibilities and duties include:

Technology Development:

• Develop and enable advanced package technology for various post-fab wafer finish and assembly processes
• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity
• Integrate semiconductors while partnering with process and product engineering teams

Yield Improvement:

• Achieve and improve yields through silicon package integration innovation, not limited to layout/design or process margin improvements
• Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes
• Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements

Quality Improvement:

• Ensure defense coverage through process, measurement, inspection, and testing
• Establish correlations between defense mechanisms to identify improvement opportunities
• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities

Collaboration and Coordination:

• Work closely with internal and external partners to build and implement technology development strategies aligned with organizational and business objectives
• Work closely with various teams, including the PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
• Ensure smooth transition from new product development, qualification, small volume production to high volume production
• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities

Requirements

• B.S/M.S./Ph.D. (or equivalent education) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material, or other related technical fields
• Experiences in semiconductor process integration will be advantageous
• Strong understanding of process flows, process interactions, and ability to integrate semiconductors while partnering with process and product engineering team
• Ability to resolve complex issues through root-cause or model-based problem solving
• Tenacity to work effectively under timelines and limited resources
• Consistent track record to solve problems and address root causes
• Good communication skills
• Keen in the semiconductor industry
• Showcase leadership potential

Embody Micron’s core values:

• People – Respect, develop, and empower others
• Innovation – Drive continuous improvement and breakthrough thinking
• Tenacity – Show grit and determination
• Collaboration – Build trust and foster teamwork
• Customer Focus – Deliver excellence and value