Global OSAT Package Principal Engineer

• Degree or MSc Degree in Mechanical, Material, Manufacturing or Electronic engineering or Equivalent
• At least 10 years working experience in wafer bumping and WLCSP.  Added advantages if having good knowledge in advanced packages (Panel Level Packaging, 2.5D/3D packaging), Flip-Chip and wire bond packages assembly.
• Knowledgeable in DOE, Process Control System and technical problem solving methodology
• Possess strong leadership, project management and critical thinking skills
• Can communicate effectively in Mandarin and English; both in verbal and written
• Have a strong semiconductor product and bumping/assembly/test process methodology understanding & trouble shooting skill.
• Excellent leadership and motivational skills. Possess strong interpersonal skills and have the ability to communicate and present across all levels of organization.
• Proven ability and flexibility to lead successfully in a complex, cross-functional multinational environment
• Ability to work independently, be hands-on and expected to dive into technical details
• Self-sufficient and resourcefulness in acquiring the appropriate technical skills and knowledge from resources across the globe

Responsibilities/Job Descriptions:

• Work with NXP Global team to drive subcon site transfer / 2nd source qual. 
• Drive qualification for bumping and assembly quality improvement, VE and subcon’s PCN projects (Including BOM/Process Change; Building Move; Production Floor Re-layout, Material Supplier Mfg Site Move; New Equip Model, etc).
• Own gap analysis, CZ/qual plan, safe launch plan and overall qualification timeline for site transfer, quality improvement, VE and subcon’s PCN projects.  
• NPI/NTI early involvement to ensure no quality excursion during ramp at subcon. 
• Technical lead the quality (CQC/CSET/Severe Incident) improvement with quality team
• Technical lead onsite root cause investigation, analysis and resolution for quality/yield excursion in subcon
• Review subcon CQC / 8D & proposed actions to prevent recurrence
• Review & provide technical inputs for CIP (Continuous Improvement Plan) in subcon assembly
• Update Bond Diagram, Package Kits, Bumping/Assembly Shop Oder Flow and working with Product Engineer on PC parts linkage
• Act as a Change Action Board (CAB) member to review and approve NPI/NTI and all changes in subcon

More information about NXP in Greater China...