Intern - Packaging Engineer

This position is a packaging back-end R&D intern, focusing on IC (integrated circuit) packaging technology research and development. The intern will collaborate with global teams to complete development projects and other tasks, including new packaging technology development, new package-related process development, advanced material interface study, advanced IC package failure analysis, and coordinating/leading development projects independently. The role also involves communication and cooperation among global teams in the US, Europe, Malaysia, Japan, and France.

Must Have

• Pursuing a Master's degree
• Major in Metallic Materials Engineering, Polymer Materials Engineering, Mechanical Engineering and Automation
• CET-4 or equivalent English level
• Ability to work in a cross-functional/global team
• Independent R&D capability

Good to Have

• CET-6 English level preferred

Job Description:
This position is a packaging back-end R&D intern, and will be focusing on IC (integrated circuit) packaging technology research and development, work with global team to finish development projects and other tasks as listed below:

• New packaging technology development
• New package related process development
• Advanced material interface study
• Advanced IC package failure analysis
• Coordinate/lead development project independently
• Communication/cooperation among global teams (US/Europe/Malaysia/Japan/France/etc.)

Qualification:

• Pursuing in master degree
• Major on: Metallic Materials Engineering; Polymer Materials Engineering; Mechanical Engineering and Automation.
• At least CET-4 degree or equivalent English level and CET-6 is preferred.
• Intention and capability to work in a cross-functional/global team environment.
• Independent R&D capability. 

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