Intern - Packaging Engineer

1 Year ago • All levels
Software Development & Engineering

Job Description

This position is a packaging back-end R&D intern, focusing on IC (integrated circuit) packaging technology research and development. The intern will collaborate with global teams to complete development projects and other tasks, including new packaging technology development, new package-related process development, advanced material interface study, advanced IC package failure analysis, and coordinating/leading development projects independently. The role also involves communication and cooperation among global teams in the US, Europe, Malaysia, Japan, and France.
Good To Have:
  • CET-6 English level preferred
Must Have:
  • Pursuing a Master's degree
  • Major in Metallic Materials Engineering, Polymer Materials Engineering, Mechanical Engineering and Automation
  • CET-4 or equivalent English level
  • Ability to work in a cross-functional/global team
  • Independent R&D capability

Add these skills to join the top 1% applicants for this job

cross-functional
game-texts
back-end

Job Description:
This position is a packaging back-end R&D intern, and will be focusing on IC (integrated circuit) packaging technology research and development, work with global team to finish development projects and other tasks as listed below:

  • New packaging technology development
  • New package related process development
  • Advanced material interface study
  • Advanced IC package failure analysis
  • Coordinate/lead development project independently
  • Communication/cooperation among global teams (US/Europe/Malaysia/Japan/France/etc.)


Qualification:

  • Pursuing in master degree
  • Major on: Metallic Materials Engineering; Polymer Materials Engineering; Mechanical Engineering and Automation.
  • At least CET-4 degree or equivalent English level and CET-6 is preferred.
  • Intention and capability to work in a cross-functional/global team environment.
  • Independent R&D capability. 


More information about NXP in Greater China...

#LI-65f0

Set alerts for more jobs like Intern - Packaging Engineer
Set alerts for new jobs by NXP
Set alerts for new Software Development & Engineering jobs in China
Set alerts for new jobs in China
Set alerts for Software Development & Engineering (Remote) jobs
Contact Us
hello@outscal.com
Made in INDIA 💛💙