Manufacturing Failure Analysis Engineer

Job Description:

• Be responsible for identifying and researching component failures of advanced packaging technology to improve product yield, quality and/or reliability.
• Evaluates the electrical and mechanical characteristics of integrated circuits, components, sub-components, and systems to determine the root cause of failure.
• Analyses failure reports and recommends corrective action to prevent re-occurrence of problems.
• Utilize and develop new application for all standard and advanced analytical equipment such as electronic test equipment and optical, laser microscope SEM/ FIB, FTIR, 2D, 3D X-ray, RIE, Chemicals BKM, CSAM/ CNC, Ion milling, sample prep and.
• Supports new product transfer and start-up and the automation and improvement of the failure analysis process.
• Strives to proliferate shared learning across sites.
• Maintain to do silicon failure analysis and debugs necessary records and reports.
• Performs other related duties as required or as directed.

Qualifications:

• Master's or a Bachelor's degree in Electrical, Electronics, or Microelectronics, or equivalent majors.
• At least 2 years of experience in relevant field
• Strong analytical and problem-solving skills, with proven ability to manage and engage stakeholders effectively.
• Proficiency in English communication, both verbal and written
• Additional qualifications include:
• Ability to work well in a diverse team environment.
• Good knowledge in one or more of these areas would be an added advantage: Device physics, I/O structure, Microprocessor architecture and micro architecture, microprocessor circuit, AI, etc.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.