Mixed-Signal IC Design Engineer

4 Months ago • All levels • $166,600 PA - $296,300 PA
Software Development & Engineering

Job Description

The Mixed-Signal IC Design Engineer will participate in defining, designing, developing, and bringing to production analog and mixed-signal circuits and sub-systems within Apple integrated circuit devices. This involves specifying, designing, implementing, and verifying these circuits, including transistor-level analog circuits, mixed-signal interfaces, and digital control and signal processing blocks. The engineer will also develop and run high-level simulations to validate top-level integration, collaborate with various cross-functional teams, define test plans, analyze results, create integration guides, and assist in the successful implementation of new circuits and sub-systems into complex SoCs. The role requires a strong understanding of analog and mixed-signal design principles and a proven track record of bringing circuits to production.
Must Have:
  • Define, design, and develop analog/mixed-signal circuits.
  • Implement and verify analog/mixed-signal circuits and sub-systems.
  • Develop and run high-level simulations.

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cross-functional

Participate in defining, designing, developing, and taking to production analog and mixed-signal circuits and sub-systems within Apple integrated circuit devices. Specify, design, implement, and verify analog and mixed-signal circuits and sub-systems, including transistor-level analog circuits, mixed-signal interfaces, and digital control and signal processing blocks. Develop and run high-level simulations to validate top-level integration. Engage with cross-functional analog, digital, DV, firmware, software, SoC architecture, technology, packaging, silicon validation, production test, manufacturing, and other teams to implement the new circuits and sub-systems and drive them into production. Define production and bench-top test-plans, analyze results, and drive DOEs. Create integration guides and user documents, and generally assist with challenges in successfully implementing the new circuits and sub-systems into complex SoCs.

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