Product Failure Analysis Engineer

1 Month ago • All levels • Product Management

Job Summary

Job Description

As a Product Failure Analysis Engineer, you will perform failure analysis and root cause analysis on Intel CPU, Chipsets, Network and Communication platform products. This includes system and/or tester testing and analysis to isolate failing instructions and signals, applying circuit analysis and various device localization techniques to pinpoint defective circuits, and conducting physical failure analysis to identify defects. Your responsibilities involve improving product yield, quality, and reliability by recommending corrective actions to counterparts in Fab, Assembly, and Test, participating in new product technology transfer and startup, enabling automation and improvement in the failure analysis process, tools, and methodology, developing new FA techniques, and sharing knowledge across sites.
Must have:
  • Bachelor's or Master's degree in Electrical, Electronics, or Microelectronics.
  • Excellent verbal and written communication skills.
  • Ability to work well in a diverse team environment.
Good to have:
  • Device physics knowledge.
  • I/O structure knowledge.
  • Microprocessor architecture and micro architecture knowledge.
  • Wireless communication knowledge.

Job Details

Job Details:

Job Description: 

In this position, you will be performing failure analysis and root cause analysis on Intel CPU, Chipsets, Network and Communication platform products. This includes PC system and/or tester testing and analysis to isolate the failing instruction and internal signal, applying circuit analysis and various device localization equipment and techniques to localize the failing circuitries and performing physical failure analysis to locate the defect. Your responsibilities will include but not be limited to:
1. Responsible for improving product yield, quality and reliability through the recommendation of corrective actions to counterparts in Fab and Assembly and Test for root cause fix.
2. Participating in new product and/or technology transfer and startup, enabling automation and improvement on the failure analysis process, tools and methodology, developing new FA techniques and proliferating learning across sites.

Qualifications:

You must possess a Master's or a Bachelor's degree in Electrical, Electronics, or Microelectronics. Additional qualifications include:
Excellent verbal and written communication skills.
Ability to work well in a diverse team environment.
Good knowledge in one or more of these areas would be an added advantage:
1. Device physics.
2. I/O structure.
3. Microprocessor architecture and micro architecture, microprocessor circuit, assembly language and IA-32.
4. Wireless communication.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (Malaysia)

Primary Location: 

Malaysia, Penang

Additional Locations:

Business group:

Manufacturing and Product Engineering (MPE) is responsible for test development across product segments, supporting 95% of Intel's revenue. We deliver comprehensive pre-production test suites and component/physical debug capabilities to enable high quality, high volume manufacturing.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

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