Spice Modeling Engineer

Broadcom is the leading provider of silicon solutions to high-performance computing, networking, mobile and consumer market segments in aggregate, covering the widest spectrum of process technologies from the very leading edge to legacy. This position is within Broadcom's Central Engineering organization, as part of the technology platform team.The technology platform team delivers CAD, design-access, custom device enhancements to foundry process technologies, silicon correlation and device & reliability modeling functions, all to support the high volume product needs of the diversified businesses. We are looking for an experienced engineer with the technical knowledge and hands on experience with advanced silicon technology, device modeling concepts, measurement automation, data collection & analysis, and GDS to SPICE design flows for silicon correlation using custom process characterization and modeling test-chips. Layout experience with device modeling test-structures would be beneficial.

Key requirements:

(1) Device physics and process technology knowledge with 16nm and newer nodes.

(2) Device modeling for HSPICE/SPECTRE circuit simulation, and GDS to SPICE flow in Cadence/Virtuoso.

(3) Device/circuit characterization with DC to RF measurement equipment.

(4) Automation skills for data-analysis and lab equipment.

(5) EE's with MS + 10 years or Ph.D + 7 years are ideal. Engineers with basic qualifications in Materials Science & Physics possessing the needed technical experience are also encouraged to apply.

(6) Excellent communication and presentation skills needed to work with a world-wide design engineering community are needed.