As a Staff Engineer, Physical Design, you will be a key part of a highly skilled global team focused on designing next-generation optical module chips for the high-performance computing AI/ML architecture space. Our custom DSP solutions power critical infrastructure in markets such as data center, connectivity, and optical module. You will work at the forefront of advanced CMOS process technology, contributing to both physical design and the development of efficient design methodologies.
In this role, you will play an essential part in developing and implementing the physical design flow for high-performance, low-power cutting-edge chips. You will work on synthesis, place and route, PGV, and timing analysis for complex logic blocks, ensuring that they meet stringent performance, power, and area targets. Furthermore, you’ll be involved in full-chip floorplanning, partition and design planning activities. By enhancing and maintaining the Place and Route flow using industry-standard EDA tools, you’ll enable seamless tape-outs and help drive continued leadership in the semiconductor industry.
Your collaboration with the RTL design and global timing teams will ensure smooth end-to-end design processes and successful delivery of best-in-class products. As the industry evolves, your contributions to methodologies will drive optimization and innovation for future technologies.
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