Staff/Principal, Process Integration, NAND NTI

As a NAND Module Process Integration Engineer in Singapore R&D, you will design, develop, integrate, and implement process solutions to improve next-generation 3D NAND Product Yield and Quality. This involves identifying module deficiencies, leading cross-functional teams, developing CSPEC criteria, coordinating manufacturing activities, and assisting in new technology transfer from R&D to manufacturing. The role requires a passion for semiconductor technology, strong analytical skills, and excellent communication.

Must Have

• Identify and quantify key module deficiencies and technology gaps.
• Lead cross-functional teams to address issues and improve process flows.
• Develop innovative solutions for next-generation 3D NAND Product Yield and Quality.
• Develop or redefine CSPEC criteria for optimal product performance.
• Coordinate manufacturing site activities for experiments and conversions.
• Undertake development projects for new integration schemes.
• Lead at quarterly yield summits and monthly program reviews.
• Assist in new technology transfer from R&D to manufacturing.
• Passion for semiconductor technology and innovation.
• Adept at data analysis, problem-solving, and process integration optimization.
• Excellent communication and cross-functional teamwork skills.

Good to Have

• PhD in Material Science, Electrical Engineering, Microelectronics, Chemical or Physics Engineering with 3+ years experience.
• Proficiency in data analysis, visualization, or simulation software (JMP, Tableau).
• Strong holistic understanding of PI modules on new NAND technologies.
• In-depth knowledge and direct experience with non-volatile memories (NAND).
• Understanding of NAND process flow, process & device interaction, yield & reliability issues.
• Experience in semiconductor R&D product life cycle from design to manufacturing.
• Self-motivated, self-governing, and able to work in demanding environments.
• Display Micron Values: People, Innovation, Tenacity, Collaboration, Customer Focus.

Perks & Benefits

• Paid Time Off
• Continuous Learning
• Wellness Programs
• Stock Purchase Program
• Health Insurance
• Recognition

As a NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Your responsibilities will include, but are not limited to, the following:

• Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability.
• Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability.
• Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and optimally communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners.
• Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility.
• Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams.
• Assist in the transfer of new technology from R&D to manufacturing. Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing.

Successful candidates for this position will have:

Must have:

• Passionate about semiconductor technology and innovation.
• Adept at data analysis, problem-solving, and process integration optimization.
• Excellent communication skills and ability to work in cross-functional teams.

Preferred to have Skills / Experiences as below:

• PhD in Material Science, Electrical Engineering, Microelectronics, Chemical or Physics Engineering, or a related field with minimum 3 years of relevant experience in semiconductor industry.
• Proficiency in data analysis, visualization or simulation software, such as JMP, Tableau is desirable.
• Ability to develop a strong holistic end-to-end understanding of PI modules on new NAND technologies and related structural & electrical fail mechanisms.
• In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
• Experience in semiconductor R&D product life cycle from design to manufacturing is desirable.
• Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment.
• Display Micron Value of People. Innovation, Tenacity, Collaboration and Customer Focus