Advanced Package Technology Engineer

• As part of WW ASIC product development team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible for developing cost effective high performance, advanced custom package solutions achieving signal integrity, thermal, structural reliability, substrate fab/package assembly design rules & project schedule requirements.
• 2.5D & 3D is cutting edge package technology with BRCM’s needs pushing the technology limits.

Job Scope (Advanced Package Technology Engineer)

• Provide deeper expertise in 2.5D / 3D technology; current and future customer engagement on technology needs & updates, consolidation of requirements and drive towards unified solution.
• Lead in identification, development & qualification; program management with external assembly partners
• Lead in memory supplier(s) engagement to define technology and quality requirements.
• Interface with other technical teams (DI, Pkg Design, Test Dev) etc. as part of Cross Functional Team.
• Support new design wins, NPI and volume ramps.
• Develop alternate sourcing & qualification.

• Basic: Master's Degree in Mechanical / Electrical / Electronics Engineering with 6+ years of relevant experience in developing cost effective, high performance (speed, density, pin count, thermal & reliable), single & multi-chip, large, complex, custom & fine pitch flip chip packaging solution with advanced multi-layer ceramic / organic substrates & Interposers; Standard & thermally enhanced fine pitch leaded & BGA wire bond & wafer level packaging solution; or PhD with 10+ years of relevant experience
• Specific: 4~6 years Hands On experience in 2.5D / 3D Development; In-depth Know-how of Advanced Silicon fab, Bump, Interposer, substrate & assembly processes, materials & supplier selection, BOM definition, thermal and mechanical interactions.
• Others:
• Sound knowledge of & hands on experience in advanced, prevailing and emerging silicon, package & substrate technologies, bumping and assembly processes, design rules, failure analysis tools and techniques, materials and equipment, applicable industry standards, regulations & quality systems.
• Good team player with project management, analytical, problem-solving and interpersonal skills. Must be self-driven, flexible and agile, result oriented individual. Ability to develop concepts into structured projects, generate new and innovative solutions to complex problems and handle multiple programs concurrently.
• Hands-on experience of use of modelling (Thermal & Mechanical) & Sub / PCB Design CAD tools (APD, AutoCAD, Solidworks etc) for design optimization.
• Sound knowledge of advanced node silicon fabrication, PCB technologies and board assembly processes, applicable industry standards, quality systems and regulations.
• Communicate extensively with internal and external team members, customers in various global locations and may require travel from time to time.