Job Description:

Become a member of the Assembly Test Technology Development in the Media, Inspection, Handling Systems, and Laser (MIHL) Module engineering team.

The role is located in Kulim as a Handling Systems development engineer leading the development and deployment of Intel's advanced chip packaging process technology.

• Responsible for developing material handling technology involving high accuracy and high-speed pick-n-place systems for next-generation semiconductor packaging technology.
• Responsibilities include development of handling process recipes, design/validation of nozzle tooling, and addressing process/equipment issues on the manufacturing floor while delivering to quality and reliability standards.
• Engage in testing and validating hardware/software upgrades to meet product requirements.
• Respond to customer requests or challenges, develop solutions to problems that meet process, quality, and cost requirements.
• Develop solutions to meet customer requirements from platform specification to validation, deployment, and proliferation to high-volume manufacturing sites.
• Must have a strong background in kinematics and motion control, Design of Experiments (DOE), structured problem solving, and statistics knowledge to plan and conduct experiments to characterize solutions throughout the product life cycle.
• Drive improvements in quality, reliability, cost, yield, process stability, productivity, and safety/ergonomics.

Qualifications:

Minimum Qualifications:

• Possess a Bachelor's or Master's degree in Robotics and Autonomous Systems, Mechanical Engineering, Electrical Engineering or related STEM field.
• Have at least 2 year of work experience. Experience with and fundamental understanding of motion control, high accuracy/speed robotic systems, and vision systems.
• Strong understanding of statistical principles, statistical process control (SPC) and Design of Experiments (DOE).
• Ability to apply fundamental scientific and engineering principles to develop novel design solutions for high volume manufacturing processes.

Preferred Qualifications:

• Fundamental understanding of semiconductor devices and packing technology. Motion control and vision systems background (High speed / high accuracy pick-n-place, 2D vision systems).
• Mechanical design experience (CAD, Solidwork, GD and T) is preferred.
• Data Science and Statistics tools (Python, Numpy/Pandas, SQL, JMP, Minitab).
• Strong influencing, written and verbal communication skills.
• Strong Project/Program management skills.

Job Type:

Experienced Hire

Shift:

Shift 1 (Malaysia)

Primary Location:

Malaysia, Kulim

Additional Locations:

Business group:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.