Job Details:

Job Description: 

Packaging Module Development Engineer within Chip Attach Module/SLI Assembly Module (CAM/SLAM) in Assembly Test Technology Development (ATTD) as part of ATTD in Asia initiative. CAM/SLAM Process covers Chip Attach, Component Attach and Solder Ball Attach Candidate will focus on Process and Technology Development for New Product (NPI), Shuttle Program, Test Vehicle and IFS Product. Technical knowledge in Research and Development, Process Engineering, Design of Experiment (DOE), Statistical Process Control (SPC), Failure Modes/Effects Analysis (FMEA), Quality, Yield Improvement, Optimization Pathfinding, developing, qualifying, and ramping materials to transfer to high volume manufacturing process in factories. Develops process specifications applying principles for design of experiments and data analysis, and documents improvements through white papers. Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Conducting fundamental studies and performing experiments to characterize materials, process, identify potential failure modes, understand the performance interactions, optimization, assess feasibility of technology use on product, and make technology recommendations. Collaborating closely with other cross-functional team to build material technologies on test vehicles and products and assessing their performance. This role is for Chip Attach Module Process

Qualifications:

BEng/MSc/PhD degree in relevant engineering disciplines (Mechanical, Materials, Chemical, Electrical), MSc or PhD is preferable.5 Years Experience Preferred. Fundamental understanding of semiconductor assembly equipment and process. Excellent influencing, written and verbal communication skills. Strong data analysis capabilities and problem solving skills. Proactive and positive approach towards challenges. Able to work under tight timelines and perform under pressure. Research and Development background and experience in Chip Attach, Deflux or Ball Attach Process. This role is for Chip Attach Module Process

          

Job Type:

College Grad

Shift:

Shift 1 (Malaysia)

Primary Location: 

Malaysia, Kulim

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.