Packaging Module Development Engineer within Chip Attach Module/SLI Assembly Module (CAM/SLAM) in Assembly Test Technology Development (ATTD) as part of ATTD in Asia initiative.
CAM/SLAM Process covers: Chip Attach, Component Attach and Solder Ball Attach
Experienced Hire
Shift 1 (Malaysia)
Malaysia, Kulim
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
N/A
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
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