Silicon Packaging Design Engineer

Job Description:

As an integral part of Intel's new Integrated Device Manufacturer 2.0 (IDM2.0) strategy, we are establishing Foundry Services (FS), a fully vertical, stand-alone foundry business, reporting directly to the CEO. Foundry Services will be a world-class foundry business and major provider of US and European based capacity to serve customers globally.

Foundry Services will be differentiated from other foundries with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe, and a world-class IP portfolio that customers can choose from, including x86 cores, graphics, media, display, AI, interconnect, fabric and other critical foundational IP's, along with Arm and RISC-V ecosystem IPs. Foundry Services will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions, using industry standard design packages.

This business unit is completely dedicated to the success of its customers with full PandL responsibilities. This model will ensure that our foundry customers' products receive our utmost focus in terms of service, technology enablement, and capacity commitments. FS is already engaged with customers today starting with our existing foundry offerings. We are expanding at a torrid pace to include our most advanced technologies, which are ideal for high-performance applications.

Responsibilities include but are not limited to:

• Drives end to end development for silicon design from concept through tapeout and implements physical layout and routing of the package design.
• Responsible for the definition and development of assembly test chips or bridge die which are used to characterize aspects of chip-package interactions.
• Provides consultation concerning packaging problems and improvements in the packaging process.
• Responds to customer and/or client requests or events as they occur.
• Develops solutions to problems utilizing formal education and judgment.

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