Member of Technical Staff

2 Hours ago • 2 Years + • Software Development & Engineering • $185,775 PA - $190,000 PA

Job Summary

Job Description

Develop electrical analysis methodology and infrastructure for the verification flow of large HPC SoCs. Perform full chip analysis, debug, and closure of all EA flows, including IR, IVD, and EM for signal and power. Provide input to full chip floor plan and guidance to implementation teams for early convergence and final closure. Collaborate with technology teams and CAD partners to drive closure targets and signoff criteria. Design and validate Power Distribution Networks optimized for best PPA in specific IPs. Expertise in electrical simulation tools, analysis methodologies, and hands-on experience in ASIC design and verification processes.
Must have:
  • PDN lead for dual package 5nm, 14LPP chips
  • EM/IR convergence for high performance designs
  • Optimize power gaters placement
  • Collaborate with design teams for power targets
  • Experience with Apache Redhawk, Cadence Voltus
  • PnR implementation from Netlist to GDSII
  • Unix, Perl, and TCL scripting

Job Details

Develop RiVos’s Electrical Analysis methodology and infrastructure to enable the verification
flow of large HPC SoCs. Perform full chip analysis debug and closure of all EA flows, including
IR, IVD, EM for signal and power. Provide input to full chip floor plan and guidance to the
implementation teams throughout the project to enable early convergence and final closure.
Collaborate with Technology team and CAD partners to drive closure targets and signoff criteria.
Design and validate Power Distribution Networks optimized for best PPA in specific Ips.
Expertise in electrical simulation tools, analysis methodologies, and hands-on experience in
ASIC design and verification processes.

Education

    • Master’s or foreign equivalent in Electronics Engineering or related field

Experience

    • 2 years of experience in job offered or related occupation.

Special Requirements: Must have at least 1 year of prior work experience in each of the following-

    • 1. PDN lead for dual package 5nm, 14LPP chips and responsible for bump planning, providing PDN specifications, SoC full flat EM/IR analysis, IP resistance, ESD placement, respective reviews and its signoff.
    • 2. EMIR convergence issues associated with high performance designs in advanced process nodes (static and dynamic IR driven timing closure).
    • 3. Optimizing power gaters placement which helps in reduction of placement and routing congestion in critical blocks.
    • 4. Collaborating with package, power and physical design teams to meet power targets, IP requirements, ESD and IR drop requirements with package.
    • 5. Experience with industry standard electrical analysis tools (Apache Redhawk, Cadence Voltus).
    • 6. Responsible for PnR implementation of multiple blocks from Netlist to GDSII, guiding peers in closing EM/IR violations and delivering good quality design.
    • 7. Scripting languages: Unix, Perl, and TCL.

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