3D Physical Design Engineer

As a 3D Physical Design Engineer, you will join a close-knit team to design and analyze 3D integrated products. This role combines traditional ASIC/SoC physical design with packaging, power, clock, and cooling analysis. You will collaborate closely with architecture and RTL teams to research and develop novel concepts for 3D integration, contributing to the world's largest AI chip technology.

Must Have

• Design and analyze 3D integrated products.
• Apply ASIC/SoC physical design, packaging, power, clock, and cooling analysis.
• Collaborate with architecture and RTL teams for 3D integration R&D.
• 10+ years of physical design/verification experience.
• Resolve block and full-chip DRC and LVS issues using ICV or Calibre tools.
• Perform IR/EM analysis and resolution.
• Optimize for physical design with RTL teams.

Good to Have

• Experience doing full chip floor planning and integration.
• Knowledge of clock distribution.
• Knowledge of cooling analysis.

Perks & Benefits

• Build a breakthrough AI platform beyond the constraints of the GPU.
• Publish and open source their cutting-edge AI research.
• Work on one of the fastest AI supercomputers in the world.
• Enjoy job stability with startup vitality.
• Simple, non-corporate work culture that respects individual beliefs.

About The Role

As a member of our tight knit physical design team, you will be working on the design and analysis of 3D integrated products. This role involves a combination of traditional ASIC/SoC physical design skills, packaging, power, clock and cooling analysis. You will work closely with the architecture and RTL team to do R&D on novel concepts for 3D integration.

Skills and Qualifications

Required

• 10+ years of physical design/verification experience.
• Strong knowledge of block level and full-chip physical verification methodology.
• Expert at optimizing for the best power/performance and area.
• Experience with the complete physical design flow. Knowledge of Synopsys tool suite is a plus.
• Expert with ICV or Calibre tools resolving block and full-chip DRC and LVS issues.
• Expert with IR/EM analysis and resolution.
• Strong ability in scripting languages like Tcl and Python. Ability to make flow enhancements.
• Demonstrated ability to work with RTL teams to optimize for physical design.
• Knowledge of 2.5D or 3D packaging solutions.

Preferred

• Experience doing full chip floor planning and integration.
• Knowledge of clock distribution.
• Knowledge of cooling analysis.

Why Join Cerebras

People who are serious about software make their own hardware. At Cerebras we have built a breakthrough architecture that is unlocking new opportunities for the AI industry. With dozens of model releases and rapid growth, we’ve reached an inflection point in our business. Members of our team tell us there are five main reasons they joined Cerebras:

1. Build a breakthrough AI platform beyond the constraints of the GPU.

2. Publish and open source their cutting-edge AI research.

3. Work on one of the fastest AI supercomputers in the world.

4. Enjoy job stability with startup vitality.

5. Our simple, non-corporate work culture that respects individual beliefs.

Read our blog: Five Reasons to Join Cerebras in 2025.

Apply today and become part of the forefront of groundbreaking advancements in AI!