Die Attach Equipment Technician
Job Description
- Experience on Hanwha Die Attach equipments
- Experience in semiconductor assembly
- Applied statistics knowledge
- Experience with Datacon 8800 FC QUANTUM equipment
- Maintain and repair Die Attach integrated line
- Perform equipment setup and conversion
- Identify, sustain, purchase, and source critical spare parts
- Maintain equipment performance to meet goals
- Improve OEE, MTBA/MTBF, PM Effectiveness
- Solve quality issues caused by machines
- Diploma in Electrical & Electronics or Mechanical Engineering
- Good technical skills on Front and Back End assembly equipment
- Strong interpersonal and communication skills
- Good decision making and problem solving skills
- Familiar with production environment and process handling
- Discipline and willing to work long hours/shifts
- Adhere to NXP Total Quality Mindset and Safety Awareness
- Adhere to NXP core values
● Die Attach Equipment Technician specialist and vast experience working on Die Attach equipment such as Datacon 8800 FC QUANTUM is a must and preferable also have experience on Hanwha Die Attach equipments.
● Maintain and repair Die Attach integrated line which include loader, unloader, die attach, AOI and reflow oven equipment.
● Perform equipment setup or conversion for any product changes for Die Attach integrated line which include loader, unloader, die attach, AOI and reflow oven equipment.
● To able to work independently to identify, sustain, purchase, find second source for Die Attach integrated critical spare and tooling.
● To maintain/sustain equipment performance to meet define goal.
● Improve FC Overall OEE, MTBA/MTBF, PM Effectiveness and Unscheduled Downtime.
● To maintain the machine performance, address the problem root cause and solve quality issue cause by the machine.
Compensation Details
● Support production to meet weekly schedule targets through working either normal or shift hours when or where needed. This especially true weekends and public holidays.
● Manage the maintenance activities of machines and fabrication of spare parts.
● Good discipline and tardiness with minimum supervise
Requirement
● Diploma in Electrical & Electronics or Mechanical and Engineering discipline, or certificate with min 5 years’ of relevant working experience in Die Attach equipment
● Experience in semiconductor assembly and applied statistics will be an advantage
● Have good technical skills on Front and Back End assembly equipment
● Strong interpersonal and communication skills
● Good decision making / problem solving skills.
● Familiar with production environment & possesses process handling knowledge. (Semiconductor).
● Must be discipline and willing to work long hours and shifts.
● Must adhere NXP Total Quality Mindset and Safety Awareness.
● Must adhere NXP core value Trust and Respect, Collaboration, Ownership, Expertise, Innovation and Growth.
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