Failure Analysis Engineer

Broadcom is seeking an experienced Failure Analysis Engineer to lead the diagnosis and characterization of complex failures in advanced silicon and packaging technologies. This role involves pioneering new workflows for next-generation technologies, leveraging deep expertise in fault isolation, EFA, and PFA. The engineer will be a hands-on technical expert, collaborating with global cross-functional teams to identify root causes and ensure the highest quality in bleeding-edge products like AI accelerators and high-speed networking solutions.

Must Have

• In-depth fault analysis across silicon and package technology
• Planning and executing FA plans (data collection, ATE datalog interpretation, non-destructive analysis)
• Fault localization (ATE, application board, PEM, DLS, OBIRCh, thermal, scan, memory)
• Physical Analysis (mechanical, chemical, PFIB), nanoprobing, and analytical techniques (FIB, SEM, EDX)
• Collaboration with global cross-functional teams (design, process, test, reliability)
• Clear communication of complex FA findings
• Developing and implementing new failure analysis methodologies
• Staying updated on latest advancements in FA techniques and semiconductor technology
• Bachelor's with 8+ years or Master's with 6+ years in Electrical, Mechanical, Chemical Engineering, Materials Science, or related field
• Strong understanding of semiconductor device physics, fabrication processes, and packaging technologies
• Proficiency in various failure analysis techniques and equipment (scan diagnostics, PEM, DLS, nanoprobing, SEM, EDS, FIB)
• Excellent problem-solving skills and methodical approach to root cause analysis
• Ability to work independently and as part of a team
• Expert project management skills

Good to Have

• Experience with <5nm finFET or GAAFET technologies
• Experience with 3DICs, CoWoS-L, co-packaged optics (CPO), or co-packaged copper (CPC)
• Expertise in design-based FA (scan and memory diagnostics)
• Expertise in beam-based FA techniques (nanoprobing, PFIB delayering / cross-section)
• ATE test flow generation, pattern modification, and hardware
• In-depth knowledge of advanced package construction and failure analysis

Perks & Benefits

• Medical, dental and vision plans
• 401(K) participation including company matching
• Employee Stock Purchase Program (ESPP)
• Employee Assistance Program (EAP)
• Company paid holidays
• Paid sick leave
• Vacation time
• Paid Family Leave and other leaves of absence (as per applicable laws)
• Discretionary annual bonus
• Equity

Job Description:

Broadcom is seeking an experienced and driven Failure Analysis Engineer. In this role, you will be the technical lead who ensures the successful diagnosis and characterization of complex failures in advanced silicon (e.g., FinFET, GAA) and advanced packaging technologies (e.g., CoWoS-S/L, 3DIC, CPO) critical to Broadcom’s most sophisticated products, including our industry-leading AI accelerators and high-speed networking solutions. You will leverage your deep expertise across all facets of FA (i.e., fault isolation, EFA, PFA) to pioneer new workflows tailored for the rapidly evolving landscape of next-generation silicon and packaging technologies. This role is built for a hands-on, strategic problem-solver seeking an opportunity to grow as a technical leader, collaborate with global cross-functional teams, and ensure the highest quality in bleeding edge technologies.

Responsibilities:

• Hands on technical expert capable of in depth fault analysis across a wide range of silicon and package technology.
• Plan and execute individual FA plans through background data collection, ATE datalog interpretation, non-destructive analysis (optical, CSAM, X-Ray, TDR, IV curve trace)
• Fault localization (ATE, application board, PEM, DLS, OBIRCh, thermal, scan, memory)
• Physical Analysis (mechanical, chemical, PFIB), nanoprobing, and analytical techniques (FIB, SEM, EDX) to isolate and characterize defects.
• Collaborate with global cross-functional teams (design, process, test, reliability) to identify root causes of failures from various stages of the product lifecycle (e.g., design, reliability, RMA).
• Clear communication of complex FA findings, both written and verbal, to enable data-driven corrective action of critical quality issues.
• Develop and implement new failure analysis methodologies and procedures unique to advanced silicon & packaging technologies to enhance efficiency and effectiveness.
• Evaluate & stay updated on the latest advancements in failure analysis techniques and semiconductor technology.
• Team-based culture through open communication, continuous improvement, and willingness to assist others.

Qualifications:

• Bachelor's and 8+ years of relevant experience, or Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field and 6+ years of relevant experience.
• Strong understanding of semiconductor device physics, fabrication processes, and packaging technologies.
• Proficiency in various failure analysis techniques and equipment (e.g., scan diagnostics, PEM, DLS, nanoprobing, SEM, EDS, FIB).
• Excellent problem-solving skills and a methodical approach to root cause analysis.
• Ability to work independently and as part of a team in a fast-paced environment.
• Broad interests, self-driven, lifelong learner, and a good team member.
• Expert project management skills, capable of managing multiple root cause projects in conjunction with lab support.

Highly Desired Qualifications:

• Experience with <5nm finFET or GAAFET technologies
• Experience with 3DICs, CoWoS-L, co-packaged optics (CPO), or co-packaged copper (CPC)
• Expertise in design-based FA (scan and memory diagnostics)
• Expertise in beam-based FA techniques (e.g., nanoprobing, PFIB delayering / cross-section)
• ATE test flow generation, pattern modification, and hardware
• In-depth knowledge of advanced package construction and failure analysis

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $108,000 - $172,800

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

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