Field Service Engineer

Quest Global is seeking a Field Service Engineer to develop and optimize processes for semiconductor chip manufacturing, including wafer cutting, die bonding, electrical connections (wire bonding/flip-chip), and encapsulation. The role involves managing precise handling of silicon wafers and individual dies, ensuring protection from damage and contamination. Candidates should have a minimum of 3 years of experience in electrical, mechanical, electronics, or computer engineering, with hands-on experience in back-end equipment and strong knowledge of statistical analysis and materials science.

Must Have

• A bachelor’s or master’s degree in electrical engineering, Mechanical, Electronics, Computer Engineering, or a related field
• Minimum 3 years of experience
• Hands-on experience with specific back-end equipment (dicing, bonding, molding, pick and place machines)
• Strong knowledge of statistical analysis, SPC, and DOE methodologies
• Familiarity with metrology and characterization techniques for film properties and physical dimensions (e.g., SEM inspection)
• Understanding materials science, adhesives, and packaging integrity

Good to Have

• Excellent problem-solving and analytical skills with a focus on detail
• Experience with Manufacturing Execution Systems (MES)
• Experience with factory automation
• Strong communication skills to collaborate effectively with cross-functional and global teams
• Ability to work in a high-volume manufacturing environment
• Ability to manage multiple projects simultaneously

Job Requirements

At Quest Global, it’s not just what we do but how and why we do it that makes us different. With over 25 years as an engineering services provider, we believe in the power of doing things differently to make the impossible possible. Our people are driven by the desire to make the world a better place—to make a positive difference that contributes to a brighter future. We bring together technologies and industries, alongside the contributions of diverse individuals who are empowered by an intentional workplace culture, to solve problems better and faster.

Key Responsibilities

• Developing and optimizing processes for precisely cutting the large silicon wafer into individual semiconductor chips (die) without causing damage or contamination.
• Managing the process of accurately picking up the individual die and bonding them onto a substrate, lead frame, or package using adhesives (epoxy) or eutectic bonding materials.
• Developing techniques for establishing robust electrical connections between the semiconductor die and the package leads using fine wires (wire bonding) or solder bumps (flip-chip attach).
• Ensuring the die and internal connections are protected from physical damage, moisture, and environmental contamination by developing and monitoring molding or encapsulation processes using protective compounds.

We are known for our extraordinary people who make the impossible possible every day. Questians are driven by hunger, humility, and aspiration. We believe that our company culture is the key to our ability to make a true difference in every industry we reach. Our teams regularly invest time and dedicated effort into internal culture work, ensuring that all voices are heard.

We wholeheartedly believe in the diversity of thought that comes with fostering a culture rooted in respect, where everyone belongs, is valued, and feels inspired to share their ideas. We know embracing our unique differences makes us better, and that solving the worlds hardest engineering problems requires diverse ideas, perspectives, and backgrounds. We shine the brightest when we tap into the many dimensions that thrive across over 21,000 difference-makers in our workplace.

Work Experience

• A bachelor’s or master’s degree in electrical engineering, Mechanical, Electronics, Computer Engineering, or a related field with minimum 3 years of experience.
• Hands-on experience with specific back-end equipment (dicing, bonding, molding, pick and place machines).
• Strong knowledge of statistical analysis, SPC, and DOE methodologies.
• Familiarity with metrology and characterization techniques for film properties and physical dimensions (e.g., SEM inspection).
• Understanding materials science, adhesives, and packaging integrity.

Benefits

• Excellent problem-solving and analytical skills with a focus on detail.
• Experience with Manufacturing Execution Systems (MES) and factory automation is beneficial.
• Strong communication skills to collaborate effectively with cross-functional and global teams.
• Ability to work in a high-volume manufacturing environment and manage multiple projects simultaneously